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UCC5511PMTR

Texas Instruments

UCC5511PMTR by Texas Instruments

UCC5511PMTR by Texas Instruments is a Data Bus Terminator with 64 terminals, operating voltage range of 2.7V to 5.25V, and BICMOS technology. It features a low profile flatpack package style, quad terminal position, and differential output for SCSI bus termination applications in commercial temperature environments.

Median Price

$6.717

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$6.717

100+ parts

-

1k+ parts

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10k+ parts

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25

$6.717

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Digiode

USA . 4,416 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,416

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Vyrian

USA . 2,336 parts In-Stock

1+ parts

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2,336

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,042 parts In-Stock

1+ parts

$9.500

100+ parts

-

1k+ parts

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10k+ parts

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1,042

$9.500

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-

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Parana Technologies

USA . 842 parts In-Stock

1+ parts

$10.614

100+ parts

-

1k+ parts

$11.108

10k+ parts

-

842

$10.614

-

$11.108

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DigiPath Technology Company

USA . 971 parts In-Stock

1+ parts

$11.687

100+ parts

$10.752

1k+ parts

-

10k+ parts

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971

$11.687

$10.752

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ChromeModa Solutions

Germany . 4,977 parts In-Stock

1+ parts

$11.926

100+ parts

$9.779

1k+ parts

-

10k+ parts

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4,977

$11.926

$9.779

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IDEA Electronic Components Group

UK . 2,060 parts In-Stock

1+ parts

$11.926

100+ parts

$11.330

1k+ parts

$10.733

10k+ parts

-

2,060

$11.926

$11.330

$10.733

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AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$13.165

100+ parts

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841

$13.165

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Corphita

USA . 323 parts In-Stock

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323

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Overview

Elevate your data bus termination needs with the UCC5511PMTR by Texas Instruments. Crafted with precision and reliability, this top-tier product boasts unmatched quality and performance. Whether you're in need of a reliable solution for SCSI bus terminators or seeking cutting-edge technology for your applications, this data bus terminator offers unparalleled value and benefits. Experience the advantage of seamless integration, optimal power supplies, and superior temperature grades to meet your commercial requirements. Trust Texas Instruments to deliver excellence in every aspect with the UCC5511PMTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it a convenient choice.

Maximum Supply Voltage: 5.25 V

Allows for compatibility with a wide range of systems and devices.

Package Shape: SQUARE

Easily fits into standard circuit board designs, simplifying integration.

Power Supplies (V): 3/5

Versatile power supply options for different system requirements.

No. of Terminals: 64

Provides flexibility for connecting multiple signal lines.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact design with fine pitch for high-density applications.

Minimum Supply Voltage: 2.7 V

Allows for operation in systems with lower power supply voltages.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, suitable for various environments.

Minimum Operating Temperature: 0 °C

Operates efficiently even in low-temperature conditions.

Terminal Position: QUAD

Quad terminal layout provides improved signal integrity and reliability.

Maximum Seated Height: 1.6 mm

Low profile design for space-saving installations.

Width: 10 mm

Compact width for efficient board space utilization.

Differential Output: YES

Provides high-quality signal output with improved noise immunity.

Length: 10 mm

Compact length suitable for tight PCB layouts.

Temperature Grade: COMMERCIAL

Designed for use in standard commercial applications.

Nominal Pull Up Resistance: 105 ohm

Optimal resistance value for reliable signal termination.

Technology: BICMOS

Utilizes high-speed and low-power BiCMOS technology for efficient operation.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and secure connections.

No. of Signal Lines: 27

Sufficient signal lines for connecting multiple devices or components.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density board designs and reduced crosstalk.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination applications, ensuring compatibility and optimal performance.

Technical Specifications

Data Bus Terminators UCC5511PMTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

UCC5511PMTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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