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MC34268DG

Onsemi

MC34268DG by Onsemi

MC34268DG by Onsemi is a small outline data bus terminator with 8 terminals. It operates b/w 0-125°C, supporting a nominal voltage of 4.25V. Ideal for applications requiring bus terminator support circuits in compact spaces.

Median Price

$0.642

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,624 parts In-Stock

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-

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$0.360

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$0.360

Flip Electronics (Authorized)

USA . 8,624 parts In-Stock

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Rochester

USA . 1,779 parts In-Stock

1+ parts

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100+ parts

$0.642

1k+ parts

$0.533

10k+ parts

$0.475

1,779

-

$0.642

$0.533

$0.475

Verical

USA . 872 parts In-Stock

1+ parts

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$0.666

10k+ parts

$0.594

872

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$0.666

$0.594

Distributors (In-Stock)

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Vyrian

USA . 1,289 parts In-Stock

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$0.460

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$0.460

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Digiode

USA . 1,093 parts In-Stock

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$0.524

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1,093

$0.524

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Flip Electronics

USA . 8,624 parts In-Stock

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8,624

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Distributors (Availability)

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Corohmni

South Africa . 447 parts In-Stock

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$0.460

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447

$0.460

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Corphita

USA . 1,866 parts In-Stock

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$0.497

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1,866

$0.497

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QUARKTWIN TECHNOLOGY LTD

USA . 29,467 parts In-Stock

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Problanco Electronics

Mexico . 7,555 parts In-Stock

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TANS Electronics

Latvia . 6,667 parts In-Stock

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Microchip USA

USA . 2,373 parts In-Stock

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Continental Prestige Electronics

USA . 1,779 parts In-Stock

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$0.400

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$0.400

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Kepictronics

USA . 1,372 parts In-Stock

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1,372

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SupplyDigital Components

Austria . 1,189 parts In-Stock

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UHIMA Technologies

Türkiye . 883 parts In-Stock

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Kulean Microsystems

USA . 294 parts In-Stock

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Overview

Enhance your data bus systems with the MC34268DG by Onsemi, a leading manufacturer known for its high-quality components. This small outline package offers dual terminal positions and a matte tin finish, ensuring reliable performance even in extreme temperatures. Perfect for a wide range of applications, this bus terminator support circuit provides customers with unmatched value, benefits, and advantages. Upgrade your electronic designs with the MC34268DG and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the data bus terminator, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, making assembly quicker and more efficient.

Maximum Operating Temperature: 125 °C

Ensures the data bus terminator can operate effectively in a wide range of temperature conditions, increasing its versatility and reliability.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability, ensuring secure connections for optimal performance.

Nominal Supply Voltage: 4.25 V

Designed to work efficiently with a supply voltage of 4.25 V, making it compatible with a range of electronic systems.

Technical Specifications

Data Bus Terminators MC34268DG attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

4.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC34268DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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