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UC560T

Texas Instruments

UC560T by Texas Instruments

The Texas Instruments UC560T is a SCSI bus terminator with 5 terminals, operating voltage range of 4-6V, and max current of 750mA. Ideal for data bus termination in applications requiring up to 27 signal lines. Temperature range: 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,007 parts In-Stock

1+ parts

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5,007

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Digiode

USA . 3,931 parts In-Stock

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3,931

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,081 parts In-Stock

1+ parts

$2.060

100+ parts

-

1k+ parts

$2.582

10k+ parts

-

2,081

$2.060

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$2.582

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DigiPath Technology Company

USA . 295 parts In-Stock

1+ parts

$2.269

100+ parts

$2.087

1k+ parts

-

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295

$2.269

$2.087

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ChromeModa Solutions

Germany . 5,853 parts In-Stock

1+ parts

$2.315

100+ parts

$1.898

1k+ parts

-

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5,853

$2.315

$1.898

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

1+ parts

$2.315

100+ parts

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1k+ parts

$2.084

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2,033

$2.315

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$2.084

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One Stop Electronics

USA . 1,045 parts In-Stock

1+ parts

$8.500

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1,045

$8.500

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AZTECH Wire

Italy . 236 parts In-Stock

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$19.450

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236

$19.450

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Corphita

USA . 2,193 parts In-Stock

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2,193

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Overview

Unleash the power of seamless data transmission with the UC560T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in every product they produce. The UC560T falls under the category of Data Bus Terminators, offering unmatched performance and durability for your connectivity needs. With its innovative design and superior materials, this terminator ensures smooth and efficient data transfer in a variety of applications. Experience the value and benefits that only Texas Instruments can provide with the UC560T, making it the ideal choice for your next project. Elevate your connectivity game today with the UC560T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY materials are durable and lightweight, making the product easy to handle and less likely to break during installation or transport.

Maximum Supply Voltage: 6 V

With a maximum supply voltage of 6V, this terminator can handle a wide range of power inputs, providing flexibility in different system configurations.

No. of Terminals: 5

Having 5 terminals allows for easy connection and termination of multiple signal lines, ensuring a reliable and stable data bus.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that this terminator can withstand heat-intensive environments, making it suitable for various industrial applications.

Nominal Supply Voltage: 4.75 V

The nominal supply voltage of 4.75V ensures efficient power consumption and stable performance, making it an energy-efficient choice for data bus systems.

Technical Specifications

Data Bus Terminators UC560T attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PSFM-T5

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

5

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP5(UNSEC)

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Current:

750 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

UC560T Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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