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UCC5614DPG4

Texas Instruments

UCC5614DPG4 by Texas Instruments

UCC5614DPG4 by Texas Instruments is a SCSI bus terminator with 16 terminals and BICMOS technology. It operates b/w 0-70°C, with supply voltage ranging from 2.7V to 5.25V. This small outline package is ideal for data bus termination applications.

Median Price

$2.080

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

$2.080

100+ parts

$2.040

1k+ parts

$2.000

10k+ parts

-

20

$2.080

$2.040

$2.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,569 parts In-Stock

1+ parts

$2.242

100+ parts

-

1k+ parts

-

10k+ parts

-

4,569

$2.242

-

-

-

Vyrian

USA . 5,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,331

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,370 parts In-Stock

1+ parts

$2.124

100+ parts

-

1k+ parts

-

10k+ parts

-

1,370

$2.124

-

-

-

Parana Technologies

USA . 713 parts In-Stock

1+ parts

$9.634

100+ parts

$894.686

1k+ parts

$8.671

10k+ parts

-

713

$9.634

$894.686

$8.671

-

DigiPath Technology Company

USA . 1,893 parts In-Stock

1+ parts

$10.608

100+ parts

$9.760

1k+ parts

-

10k+ parts

-

1,893

$10.608

$9.760

-

-

ChromeModa Solutions

Germany . 3,534 parts In-Stock

1+ parts

$10.825

100+ parts

$8.876

1k+ parts

-

10k+ parts

-

3,534

$10.825

$8.876

-

-

IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$10.825

100+ parts

$10.284

1k+ parts

$9.742

10k+ parts

-

1,385

$10.825

$10.284

$9.742

-

Microchip USA

USA . 2,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,620

-

-

-

-

Overview

Enhance your data bus systems with the UCC5614DPG4 by Texas Instruments, a top-notch manufacturer known for quality products. Designed for SCSI bus terminators, this compact device offers high reliability and performance in a variety of applications. With a wide operating voltage range and dual terminal position, this terminator ensures seamless communication while providing value and benefits to customers. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the data bus terminator.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 5.25 V

Can handle a wide range of input voltages for versatile compatibility.

Package Shape: RECTANGULAR

Fits standard packaging requirements for electronic components.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies for flexible usage.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board.

Minimum Supply Voltage: 2.7 V

Can operate effectively even with a low input voltage.

Maximum Operating Temperature: 70 °C

Ensures stable performance in a wide range of operating conditions.

Minimum Operating Temperature: 0 °C

Suitable for use in various temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a corrosion-resistant and reliable terminal finish.

Terminal Position: DUAL

Offers flexibility in connection options.

Maximum Seated Height: 1.75 mm

Low profile design for space-constrained applications.

Width: 3.9 mm

Compact width for efficient board layout.

Maximum Time At Peak Reflow Temperature (s): 30

Supports easy and quick soldering during assembly.

Peak Reflow Temperature °C: 260

Can withstand high-temperature solder reflow processes.

Length: 9.9 mm

Optimal length for fitting into standard circuit board designs.

Temperature Grade: COMMERCIAL

Suitable for commercial electronic applications.

Nominal Pull Up Resistance: 110 ohm

Provides the necessary resistance for proper signal termination.

Technology: BICMOS

Utilizes BiCMOS technology for high-speed and low-power operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connection.

No. of Signal Lines: 9

Supports multiple signal lines for data transmission.

Nominal Supply Voltage: 3.3 V

Optimal supply voltage for efficient performance.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into circuit board layouts.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for enhanced reliability.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination applications, ensuring compatibility and performance.

Technical Specifications

Data Bus Terminators UCC5614DPG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

UCC5614DPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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