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UCC5618PWPTRG4

Texas Instruments

UCC5618PWPTRG4 by Texas Instruments

UCC5618PWPTRG4 by Texas Instruments is a SCSI bus terminator with 18 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70°C, has a supply voltage range of 4-5.25V, and features BICMOS technology. This small outline package with dual terminals is ideal for commercial applications requiring reliable data bus termination.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,692 parts In-Stock

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8,692

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Digiode

USA . 4,044 parts In-Stock

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4,044

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North Shore Components

USA . 1,924 parts In-Stock

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1,924

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Distributors (Availability)

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Parana Technologies

USA . 730 parts In-Stock

1+ parts

$7.771

100+ parts

-

1k+ parts

$8.314

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730

$7.771

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$8.314

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DigiPath Technology Company

USA . 625 parts In-Stock

1+ parts

$8.556

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$7.872

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625

$8.556

$7.872

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ChromeModa Solutions

Germany . 3,698 parts In-Stock

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$8.731

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$7.159

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3,698

$8.731

$7.159

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IDEA Electronic Components Group

UK . 89 parts In-Stock

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$8.731

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$8.294

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$7.858

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89

$8.731

$8.294

$7.858

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AZTECH Wire

Italy . 845 parts In-Stock

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$9.664

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$9.664

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One Stop Electronics

USA . 217 parts In-Stock

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$33.500

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$33.500

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Component Stockers USA

USA . 427 parts In-Stock

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$99.990

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Corphita

USA . 1,919 parts In-Stock

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Microchip USA

USA . 371 parts In-Stock

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Overview

Enhance your data bus systems with the UCC5618PWPTRG4 by Texas Instruments, a high-quality SCSI bus terminator designed to optimize performance and reliability. With a compact design and advanced BICMOS technology, this terminator offers seamless integration and superior signal integrity. Perfect for a wide range of applications, from industrial automation to telecommunications, this product ensures smooth data transmission and efficient operation. Trust Texas Instruments for cutting-edge solutions that deliver value and quality, making your projects stand out from the rest. Upgrade your systems today with the UCC5618PWPTRG4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various electronic applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and enhancing the overall design of the circuit.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in system integration.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to incorporate into circuit designs, optimizing space usage on the PCB.

Power Supplies (V): 4.75

The specified power supply voltage of 4.75V ensures stable and reliable operation of the device within safe voltage limits.

No. of Terminals: 28

With a high number of terminals, the device is capable of supporting complex signal routing and connectivity requirements in data bus applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style with small outline, thin profile, and shrink pitch makes it suitable for applications where space is limited, without compromising functionality.

Minimum Supply Voltage: 4 V

The minimum supply voltage of 4V ensures the device can operate effectively even under low power conditions, enhancing its reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the device to withstand elevated temperatures, making it suitable for use in industrial environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures the device can function efficiently in a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Having dual terminal positions allows for flexible installation and routing options, accommodating different PCB layouts and designs.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm ensures the device can be mounted close to the PCB surface, minimizing signal interference and optimizing signal integrity.

Width: 4.4 mm

The narrow width of 4.4mm enables efficient placement of the device on the PCB, contributing to a more compact and streamlined circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, the device offers ease of soldering during manufacturing processes, ensuring reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C indicates the device can withstand elevated temperatures during soldering without compromising its performance.

Length: 9.7 mm

The compact length of 9.7mm allows for efficient use of space on the PCB, contributing to a more organized and optimized circuit layout.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades makes the device suitable for standard operating conditions in commercial electronics applications.

Nominal Pull Up Resistance: 110 ohm

The specified nominal pull-up resistance of 110 ohms helps maintain signal integrity and impedance matching in data bus applications.

Technology: BICMOS

Utilizing BiCMOS technology offers a combination of high-speed performance and low-power consumption, making the device energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and rework, ensuring secure connections and simplifying manufacturing processes.

No. of Signal Lines: 18

With 18 signal lines, the device can support a significant amount of data transfer and communication requirements in data bus systems.

Nominal Supply Voltage: 4.75 V

The specified nominal supply voltage of 4.75V ensures consistent and stable operation of the device within optimal voltage ranges.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting on the PCB, enabling compact circuit designs with enhanced connectivity.

Moisture Sensitivity Level (MSL): 2

Having an MSL of 2 indicates moderate moisture sensitivity, making the device suitable for standard handling and storage conditions in manufacturing.

Interface IC Type: SCSI BUS TERMINATOR

Designed specifically for SCSI bus termination, the device ensures proper impedance matching and signal integrity in SCSI bus applications, making it a reliable choice for data bus systems.

Technical Specifications

Data Bus Terminators UCC5618PWPTRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.75

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

UCC5618PWPTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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