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NUF2030XV6T1

Onsemi

NUF2030XV6T1 by Onsemi

NUF2030XV6T1 by Onsemi is a Data Bus Terminator with 6 terminals, operating temp range of -55 to 125 °C. It features Gull Wing terminal form, 0.5mm pitch, and MIL temperature grade. Ideal for applications requiring small outline packages in military-grade environments.

Median Price

$0.229

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,274 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

3,274

-

$0.238

$0.197

$0.176

Verical

USA . 3,274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.220

3,274

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-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,098 parts In-Stock

1+ parts

$0.185

100+ parts

-

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2,098

$0.185

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Vyrian

USA . 7,173 parts In-Stock

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7,173

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,437 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

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2,437

$0.176

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Corohmni

South Africa . 87 parts In-Stock

1+ parts

$0.195

100+ parts

-

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87

$0.195

-

-

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AZTECH Wire

Italy . 219 parts In-Stock

1+ parts

$21.980

100+ parts

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219

$21.980

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SupplyDigital Components

Austria . 7,666 parts In-Stock

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7,666

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Problanco Electronics

Mexico . 4,326 parts In-Stock

1+ parts

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4,326

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TANS Electronics

Latvia . 1,739 parts In-Stock

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1,739

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Kulean Microsystems

USA . 560 parts In-Stock

1+ parts

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560

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UHIMA Technologies

Türkiye . 371 parts In-Stock

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371

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Overview

Experience unparalleled data transmission reliability with the NUF2030XV6T1 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and precision engineering in all their products. The NUF2030XV6T1 falls under the category of Data Bus Terminators, making it an essential component for ensuring optimal signal integrity in various electronic applications. With its small outline, thin profile, and dual terminal position, this terminator offers superior performance while maintaining a compact design. Trust Onsemi to deliver unmatched value and efficiency with the NUF2030XV6T1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the internal components of the terminator, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, making installation and assembly processes more efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this terminator can withstand harsh environmental conditions without affecting its performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the terminator can operate in a wide range of temperatures, making it versatile for various applications.

No. of Signal Lines: 2

Having 2 signal lines allows for effective termination of data buses, reducing signal reflections and ensuring smooth data transmission.

Technical Specifications

Data Bus Terminators NUF2030XV6T1 attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NUF2030XV6T1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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