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UCC5617PWP

Texas Instruments

UCC5617PWP by Texas Instruments

UCC5617PWP by Texas Instruments is a SCSI bus terminator with 18 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70°C, with a supply voltage range of 4-5.25V. This small outline package is ideal for commercial applications requiring high-speed data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,458 parts In-Stock

1+ parts

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5,458

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Digiode

USA . 4,293 parts In-Stock

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4,293

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Distributors (Availability)

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$7.019

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460

$7.019

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Parana Technologies

USA . 2,104 parts In-Stock

1+ parts

$10.399

100+ parts

$965.683

1k+ parts

$9.359

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2,104

$10.399

$965.683

$9.359

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DigiPath Technology Company

USA . 2,158 parts In-Stock

1+ parts

$11.450

100+ parts

$10.534

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2,158

$11.450

$10.534

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ChromeModa Solutions

Germany . 1,320 parts In-Stock

1+ parts

$11.684

100+ parts

$9.581

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1,320

$11.684

$9.581

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IDEA Electronic Components Group

UK . 979 parts In-Stock

1+ parts

$11.684

100+ parts

$11.100

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$10.516

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979

$11.684

$11.100

$10.516

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One Stop Electronics

USA . 750 parts In-Stock

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$20.500

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750

$20.500

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Corphita

USA . 760 parts In-Stock

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760

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Overview

Enhance your data bus systems with the UCC5617PWP by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions in the form of data bus terminators. This versatile product offers seamless integration, ensuring optimal performance and efficiency in various applications. With a wide range of benefits such as high precision, stability, and durability, the UCC5617PWP provides exceptional value to customers looking to enhance their electronic designs. Upgrade your systems today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and lightweight design for easy installation in various systems.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards without the need for additional hardware.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages for flexibility in different applications.

Package Shape: RECTANGULAR

Compact shape enables space-saving installation in tight spaces.

Power Supplies (V): 5

Optimal power supply voltage ensures stable performance and reliable operation.

No. of Terminals: 28

Sufficient terminals for connecting multiple signal lines and power supplies.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Streamlined package design for efficient use of space and improved signal transmission.

Minimum Supply Voltage: 4 V

Operates efficiently even at low supply voltages, enhancing energy efficiency.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures in various environments for reliable performance.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, ensuring usability in diverse settings.

Terminal Position: DUAL

Dual terminal position provides redundancy for enhanced reliability and signal integrity.

Maximum Seated Height: 1.2 mm

Low profile design for minimal interference with surrounding components and improved airflow.

Width: 4.4 mm

Narrow width for efficient use of space on circuit boards and compact systems.

Length: 9.7 mm

Compact length for easy integration in systems with limited space available.

Temperature Grade: COMMERCIAL

Suitable for use in commercial applications with standard temperature requirements.

Nominal Pull Up Resistance: 110 ohm

Optimal resistance value for stable signal transmission and noise reduction.

Technology: BICMOS

Utilizes BiCMOS technology for improved performance, power efficiency, and signal integrity.

Terminal Form: GULL WING

Gull wing terminal design for secure connection and easy soldering on circuit boards.

No. of Signal Lines: 18

Supports multiple signal lines for data transmission, making it suitable for complex systems.

Nominal Supply Voltage: 4.75 V

Ideal supply voltage to ensure stable operation, performance, and longevity of the product.

Terminal Pitch: 0.65 mm

Optimal terminal pitch for efficient signal transmission and easier PCB layout.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and proper signal termination.

Technical Specifications

Data Bus Terminators UCC5617PWP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

UCC5617PWP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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