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UC5613QPTR

Texas Instruments

UC5613QPTR by Texas Instruments

UC5613QPTR by Texas Instruments is a Data Bus Terminator with 28 terminals, operating at 5V. It features a pull-up resistance of 110 ohm and is designed for SCSI bus termination applications. With a temperature range of 0-70°C, this chip carrier package offers reliable performance in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,034 parts In-Stock

1+ parts

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4,034

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Digiode

USA . 3,561 parts In-Stock

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3,561

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 552 parts In-Stock

1+ parts

$11.366

100+ parts

-

1k+ parts

$11.792

10k+ parts

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552

$11.366

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$11.792

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DigiPath Technology Company

USA . 1,939 parts In-Stock

1+ parts

$12.516

100+ parts

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1,939

$12.516

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ChromeModa Solutions

Germany . 1,975 parts In-Stock

1+ parts

$12.771

100+ parts

$10.472

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1,975

$12.771

$10.472

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$12.771

100+ parts

$12.132

1k+ parts

$11.494

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636

$12.771

$12.132

$11.494

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AZTECH Wire

Italy . 831 parts In-Stock

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$17.926

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831

$17.926

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One Stop Electronics

USA . 700 parts In-Stock

1+ parts

$29.500

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700

$29.500

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Corphita

USA . 1,876 parts In-Stock

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1,876

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Overview

Enhance your data bus performance with the Texas Instruments UC5613QPTR. Crafted with precision and superior quality, this SCSI bus terminator offers unparalleled reliability and efficiency. Perfect for a wide range of applications, this chip carrier package ensures seamless integration and optimal functionality. Elevate your system's performance with the UC5613QPTR, designed to deliver exceptional value and benefits to our customers. Trust in Texas Instruments for cutting-edge technology and unmatched innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on circuit boards, saving space and improving reliability.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources, making it versatile.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of board space in electronic assemblies.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies integration into existing electronic systems.

No. of Terminals: 28

The numerous terminals provide flexibility in connections and support complex data bus systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers high-density mounting and excellent thermal performance.

Minimum Supply Voltage: 3.8 V

With a low minimum supply voltage requirement, the product can operate efficiently even in slightly lower power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliable performance in varying environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes the product suitable for a wide range of applications, including industrial settings.

Terminal Position: QUAD

The quad terminal position simplifies installation and facilitates a secure connection to other components.

Maximum Seated Height: 4.57 mm

The low seated height allows for a compact and space-saving design.

Width: 11.505 mm

The compact width of the product enables efficient placement on electronic boards with limited space.

Length: 11.505 mm

The product's square shape and length make it easy to integrate into various electronic assemblies.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance within standard operating conditions.

Nominal Pull Up Resistance: 110 ohm

The 110 ohm nominal pull up resistance helps maintain signal integrity in data bus communication, reducing interference.

Technology: BIPOLAR

The bipolar technology used in the product offers high-speed operation and low power consumption, making it efficient.

Terminal Form: J BEND

The J bend terminal form provides a secure and reliable connection in electronic assemblies.

No. of Signal Lines: 9

Having 9 signal lines supports complex data transmission requirements in high-speed communication systems.

Nominal Supply Voltage: 4.75 V

The 4.75V nominal supply voltage ensures stable operation within the recommended voltage range.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for reliable connections and easy integration into standard PCB layouts.

Interface IC Type: SCSI BUS TERMINATOR

Compatible with SCSI bus systems, the interface IC type ensures seamless integration and reliable data transmission.

Technical Specifications

Data Bus Terminators UC5613QPTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

Length:

11.505 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.505 mm

Trade Compliance

UC5613QPTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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