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UCC5616N

Texas Instruments

UCC5616N by Texas Instruments

UCC5616N by Texas Instruments is a SCSI bus terminator with 16 terminals and 9 signal lines. It operates b/w 0-70°C, with a supply voltage range of 4-5.25V. This rectangular package is ideal for commercial applications requiring a pull-up resistance of 110 ohms.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,260 parts In-Stock

1+ parts

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3,260

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Digiode

USA . 1,240 parts In-Stock

1+ parts

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1,240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 881 parts In-Stock

1+ parts

$5.842

100+ parts

-

1k+ parts

$6.625

10k+ parts

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881

$5.842

-

$6.625

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DigiPath Technology Company

USA . 902 parts In-Stock

1+ parts

$6.433

100+ parts

$5.918

1k+ parts

-

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902

$6.433

$5.918

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ChromeModa Solutions

Germany . 5,896 parts In-Stock

1+ parts

$6.564

100+ parts

$5.382

1k+ parts

-

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5,896

$6.564

$5.382

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IDEA Electronic Components Group

UK . 896 parts In-Stock

1+ parts

$6.564

100+ parts

-

1k+ parts

$5.908

10k+ parts

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896

$6.564

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$5.908

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AZTECH Wire

Italy . 226 parts In-Stock

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$11.252

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226

$11.252

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One Stop Electronics

USA . 985 parts In-Stock

1+ parts

$21.500

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985

$21.500

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Corphita

USA . 4,232 parts In-Stock

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4,232

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Overview

Elevate your data bus performance with the UCC5616N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability with this SCSI bus terminator. Whether you're looking to enhance your system's efficiency or ensure seamless communication between components, this product offers unmatched value and benefits. Upgrade now and experience the advantages of Texas Instruments' innovative technology in data bus terminators.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and strength, making the product reliable for long-term use.

Maximum Supply Voltage: 5.25 V

Ensures compatibility with a wide range of systems and devices without risk of damage from overvoltage.

Package Shape: RECTANGULAR

Compact and space-saving design for easy installation in various setups.

No. of Terminals: 16

Sufficient terminals for connecting multiple signal lines and ensuring proper communication.

Maximum Operating Temperature: 70 °C

Capable of operating in high temperature environments without performance degradation.

Nominal Pull Up Resistance: 110 ohm

Optimal resistance value for maintaining signal integrity and preventing interference.

No. of Signal Lines: 9

Provides flexibility and versatility for connecting multiple devices or components.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and reliable performance in SCSI setups.

Technical Specifications

Data Bus Terminators UCC5616N attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

Length:

19.3 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

UCC5616N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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