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UCC5606N

Texas Instruments

UCC5606N by Texas Instruments

UCC5606N by Texas Instruments is a SCSI bus terminator with 16 terminals, BICMOS technology, and 3.3V nominal voltage. It operates b/w 0-70°C and has a pull-up resistance of 110 ohms. Ideal for data bus termination in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,686 parts In-Stock

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Digiode

USA . 2,047 parts In-Stock

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2,047

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Fibra_Brandt Electronic GMBH

Germany . 12 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 867 parts In-Stock

1+ parts

$8.799

100+ parts

-

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$9.484

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867

$8.799

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$9.484

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ChromeModa Solutions

Germany . 6,604 parts In-Stock

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$9.887

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$8.107

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6,604

$9.887

$8.107

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IDEA Electronic Components Group

UK . 1,128 parts In-Stock

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$9.887

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$9.393

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$8.898

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1,128

$9.887

$9.393

$8.898

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AZTECH Wire

Italy . 600 parts In-Stock

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$11.095

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600

$11.095

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One Stop Electronics

USA . 450 parts In-Stock

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$50.500

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$50.500

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Kepictronics

USA . 1,500 parts In-Stock

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DigiPath Technology Company

USA . 1,027 parts In-Stock

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$8.914

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$8.914

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Corphita

USA . 103 parts In-Stock

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Overview

Elevate your data bus termination with the UCC5606N by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-of-the-line solutions for a wide range of applications. The UCC5606N stands out in its category, offering customers unparalleled value, reliability, and performance. Say goodbye to connectivity issues and hello to seamless data transmission with this innovative product. Trust Texas Instruments to provide you with the best in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for long-term use.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power input, accommodating a wide range of systems and setups.

Package Shape: RECTANGULAR

The rectangular shape enables easy installation and integration into various electronic devices and systems.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard electronics and promotes efficient energy consumption.

No. of Terminals: 16

Having 16 terminals provides ample connections for multiple signal lines, contributing to the product's versatility.

Package Style (Meter): IN-LINE

The in-line package style facilitates a streamlined and organized arrangement of components for easier installation and maintenance.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage allows for operation in power-sensitive applications without compromising performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the terminator can withstand high temperatures in various operating environments.

Minimum Operating Temperature: 0 °C

The terminator can function reliably at low temperatures down to 0°C, making it suitable for a wide range of operating conditions.

Terminal Position: DUAL

The dual terminal position offers flexibility in connection options and enhances the product's compatibility with different systems.

Maximum Seated Height: 5.08 mm

The low seated height allows for a compact design, ideal for space-constrained applications.

Width: 7.62 mm

The moderate width enables easy installation and compatibility with standard spacing requirements in electronic equipment.

Length: 19.305 mm

The length provides sufficient space for multiple terminals and signal lines while maintaining a compact form factor.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance under typical operating conditions in commercial applications.

Nominal Pull Up Resistance: 110 ohm

The 110 ohm pull-up resistance helps optimize signal integrity and reduce interference, enhancing overall system performance.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connections and easy soldering for reliable and robust terminations.

No. of Signal Lines: 9

With 9 signal lines, the terminator can support multiple data transmission paths, enhancing connectivity and communication within the system.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is standard in many electronic devices, ensuring compatibility and consistent performance.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides adequate spacing for easy connections and reduces the risk of signal interference.

Interface IC Type: SCSI BUS TERMINATOR

Designed specifically for SCSI bus terminations, the interface IC type ensures seamless integration and optimal performance in SCSI applications.

Technical Specifications

Data Bus Terminators UCC5606N attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

UCC5606N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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