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SN74S1052DWG4

Texas Instruments

SN74S1052DWG4 by Texas Instruments

SN74S1052DWG4 by Texas Instruments is a 20-terminal data bus terminator in small outline package. It operates b/w 0-70°C with nickel palladium gold finish, suitable for diode bus termination arrays. With 16 signal lines and 5V supply voltage, it offers dual terminal position and gull wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,390 parts In-Stock

1+ parts

-

100+ parts

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5,390

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Digiode

USA . 1,488 parts In-Stock

1+ parts

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1,488

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 864 parts In-Stock

1+ parts

$8.485

100+ parts

-

1k+ parts

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10k+ parts

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864

$8.485

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Parana Technologies

USA . 1,734 parts In-Stock

1+ parts

$10.538

100+ parts

-

1k+ parts

$11.043

10k+ parts

-

1,734

$10.538

-

$11.043

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DigiPath Technology Company

USA . 1,828 parts In-Stock

1+ parts

$11.603

100+ parts

$10.675

1k+ parts

-

10k+ parts

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1,828

$11.603

$10.675

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$11.840

100+ parts

$11.248

1k+ parts

$10.656

10k+ parts

-

1,473

$11.840

$11.248

$10.656

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ChromeModa Solutions

Germany . 1,382 parts In-Stock

1+ parts

$11.840

100+ parts

$9.709

1k+ parts

-

10k+ parts

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1,382

$11.840

$9.709

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One Stop Electronics

USA . 1,053 parts In-Stock

1+ parts

$41.500

100+ parts

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1,053

$41.500

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Corphita

USA . 4,261 parts In-Stock

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4,261

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Overview

Enhance your data bus systems with the SN74S1052DWG4 by Texas Instruments, a premium quality diode bus termination array designed to optimize signal integrity and prevent reflections within your circuits. Texas Instruments is renowned for its commitment to innovation and reliability, ensuring that this product meets the highest standards of performance. Ideal for a wide range of applications, this small outline package offers customers exceptional value and benefits by providing a seamless solution for managing data flow efficiently. Upgrade your technology with the SN74S1052DWG4 and experience the difference that superior quality and advanced engineering can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to damage, making this product a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 20

With 20 terminals, this product can support a wide range of connections, making it versatile and suitable for various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even in demanding environments or under heavy loads.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the product.

Width: 7.5 mm

With a compact width of 7.5 mm, this product is space-efficient and can be easily integrated into tight layouts or designs.

Nominal Supply Voltage: 5 V

Operates at a standard 5V supply voltage, making it compatible with most systems and ensuring easy integration without the need for additional components.

Technical Specifications

Data Bus Terminators SN74S1052DWG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74S1052DWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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