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UCC5614J

Texas Instruments

UCC5614J by Texas Instruments

UCC5614J by Texas Instruments is a SCSI bus terminator with 16 terminals, BICMOS technology, and 3.3V nominal voltage. It operates b/w 0-70°C, has a max seated height of 5.08mm, and offers 110 ohm pull-up resistance. Ideal for data bus termination in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,520 parts In-Stock

1+ parts

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2,520

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Vyrian

USA . 2,436 parts In-Stock

1+ parts

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2,436

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 342 parts In-Stock

1+ parts

$7.500

100+ parts

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342

$7.500

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Parana Technologies

USA . 1,630 parts In-Stock

1+ parts

$12.673

100+ parts

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1k+ parts

$13.136

10k+ parts

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1,630

$12.673

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$13.136

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DigiPath Technology Company

USA . 1,958 parts In-Stock

1+ parts

$13.954

100+ parts

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1,958

$13.954

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ChromeModa Solutions

Germany . 5,851 parts In-Stock

1+ parts

$14.239

100+ parts

$11.676

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5,851

$14.239

$11.676

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$14.239

100+ parts

$13.527

1k+ parts

$12.815

10k+ parts

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1,208

$14.239

$13.527

$12.815

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$15.750

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570

$15.750

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Corphita

USA . 4,673 parts In-Stock

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4,673

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Overview

Unlock the full potential of your data bus systems with the Texas Instruments UCC5614J. Crafted with precision and expertise, this high-quality SCSI bus terminator offers unparalleled performance and reliability. Ideal for a wide range of applications, this innovative product ensures seamless communication and optimal signal integrity. Experience the value and benefits that only Texas Instruments can deliver, with the UCC5614J setting new standards in the industry. Upgrade your systems today and elevate your operations to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures excellent durability and reliability, making the product suitable for long-term use in various environments.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of power inputs effectively.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and integration into existing systems or setups.

Power Supplies (V): 3/5

Support for dual power supplies ensures redundancy and allows for seamless operation even if one power source fails.

No. of Terminals: 16

The high number of terminals provides ample connectivity options, making this product versatile for different applications.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for efficient use of PCB real estate.

Minimum Supply Voltage: 2.7 V

With a low minimum supply voltage, this product can operate efficiently even with limited power resources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures the product can function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature indicates that the product can start up and operate smoothly even in cold environments.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and connection options, enhancing usability.

Maximum Seated Height: 5.08 mm

The low seated height makes this product suitable for compact designs and installations where space is limited.

Width: 7.62 mm

The moderate width of the product allows for easy integration into various systems without taking up too much space.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is suitable for standard operating conditions commonly found in commercial settings.

Nominal Pull Up Resistance: 110 ohm

The specified pull up resistance ensures stable and reliable signal transmission within the system.

Technology: BICMOS

The use of BiCMOS technology offers a balance between the advantages of bipolar and CMOS technologies, providing high performance and efficiency.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation process and ensures secure connections on the PCB.

No. of Signal Lines: 9

The sufficient number of signal lines allows for effective communication and data transmission between connected devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V indicates the standard operating voltage for this product, ensuring compatibility with most systems.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm offers ease of soldering and assembly on standard PCBs, enhancing the product's usability.

Interface IC Type: SCSI BUS TERMINATOR

The SCSI interface IC type ensures compatibility with SCSI bus systems, making this product an ideal choice for such applications.

Technical Specifications

Data Bus Terminators UCC5614J attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-CDIP-T16

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

UCC5614J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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