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UCC5681PW24

Texas Instruments

UCC5681PW24 by Texas Instruments

UCC5681PW24 by Texas Instruments is a SCSI bus terminator with 24 terminals, operating at 3.3V nominal voltage and supporting 9 signal lines. It features a BICMOS technology, dual terminal position, and differential output for high-performance data bus termination applications. The package style is small outline with thin profile and shrink pitch, suitable for commercial-grade temperature environments up to 70°C.

Median Price

$1.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$1.600

1k+ parts

$1.330

10k+ parts

$1.180

120

-

$1.600

$1.330

$1.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,128 parts In-Stock

1+ parts

$1.244

100+ parts

-

1k+ parts

-

10k+ parts

-

3,128

$1.244

-

-

-

Vyrian

USA . 240 parts In-Stock

1+ parts

$1.310

100+ parts

-

1k+ parts

-

10k+ parts

-

240

$1.310

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,862 parts In-Stock

1+ parts

$1.179

100+ parts

-

1k+ parts

-

10k+ parts

-

3,862

$1.179

-

-

-

Parana Technologies

USA . 448 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

$8.093

10k+ parts

-

448

$7.581

-

$8.093

-

ChromeModa Solutions

Germany . 4,928 parts In-Stock

1+ parts

$8.518

100+ parts

$6.985

1k+ parts

-

10k+ parts

-

4,928

$8.518

$6.985

-

-

IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$8.518

100+ parts

$8.092

1k+ parts

$7.666

10k+ parts

-

986

$8.518

$8.092

$7.666

-

DigiPath Technology Company

USA . 2,077 parts In-Stock

1+ parts

-

100+ parts

$7.680

1k+ parts

-

10k+ parts

-

2,077

-

$7.680

-

-

Microchip USA

USA . 354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

354

-

-

-

-

Overview

Elevate your data bus performance with the UCC5681PW24 by Texas Instruments. Crafted with precision and expertise, this SCSI bus terminator offers unmatched quality and reliability for a wide range of applications. With its compact design and advanced technology, this product ensures seamless communication and optimal function in any environment. Trust in Texas Instruments to deliver superior products that exceed expectations and elevate your projects to new heights. Choose the UCC5681PW24 for unparalleled value, benefits, and advantages that will propel your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space on the circuit board.

Maximum Supply Voltage: 5.25 V

Ability to handle high supply voltages ensures compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the circuit board.

No. of Terminals: 24

Higher number of terminals enable better connectivity and signal transmission.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage allows for operation in systems with lower voltage requirements.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures makes the product suitable for a wide range of applications.

No. of Signal Lines: 9

Multiple signal lines allow for effective communication and data transfer between devices.

Technical Specifications

Data Bus Terminators UCC5681PW24 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

UCC5681PW24 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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