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UC5608QPTR

Texas Instruments

UC5608QPTR by Texas Instruments

UC5608QPTR by Texas Instruments is a Data Bus Terminator with 28 terminals, operating at 0-70°C. It features a supply voltage range of 4-5.25V and offers a pull-up resistance of 110Ω. Ideal for SCSI bus termination applications due to its bipolar technology and J-bend terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

1+ parts

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10,000

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Digiode

USA . 3,517 parts In-Stock

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3,517

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Vyrian

USA . 3,292 parts In-Stock

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3,292

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R&J Components

USA . 2,250 parts In-Stock

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2,250

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Classic Components Corporation

USA . 1,442 parts In-Stock

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1,442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,068 parts In-Stock

1+ parts

$6.489

100+ parts

$602.601

1k+ parts

$5.840

10k+ parts

-

2,068

$6.489

$602.601

$5.840

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DigiPath Technology Company

USA . 782 parts In-Stock

1+ parts

$7.145

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782

$7.145

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ChromeModa Solutions

Germany . 2,487 parts In-Stock

1+ parts

$7.291

100+ parts

$5.979

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2,487

$7.291

$5.979

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IDEA Electronic Components Group

UK . 2,136 parts In-Stock

1+ parts

$7.291

100+ parts

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$6.562

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2,136

$7.291

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$6.562

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AZTECH Wire

Italy . 459 parts In-Stock

1+ parts

$15.192

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459

$15.192

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One Stop Electronics

USA . 1,186 parts In-Stock

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$22.500

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1,186

$22.500

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Corphita

USA . 4,561 parts In-Stock

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4,561

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Overview

Enhance your data bus performance with the UC5608QPTR by Texas Instruments. Crafted with precision and reliability, this chip carrier package terminator is designed to optimize signal integrity in SCSI applications. With a nominal pull-up resistance of 110 ohms and a technology that ensures seamless connectivity, this commercial-grade data terminator offers unparalleled value to customers seeking superior quality and performance. Trust Texas Instruments to deliver cutting-edge solutions that elevate your system's efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and ensuring stable connection.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, making it versatile and compatible with various systems.

Terminal Position: QUAD

Quad terminal position enhances signal transmission efficiency and reduces interference, ensuring high performance.

Width: 11.5062 mm

Compact width size saves space and allows for efficient packing of components on a circuit board.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI buses, ensuring optimal termination and signal integrity in data communication.

Technical Specifications

Data Bus Terminators UC5608QPTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5062 mm

Trade Compliance

UC5608QPTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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