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UC5601QPR

Texas Instruments

UC5601QPR by Texas Instruments

UC5601QPR by Texas Instruments is a Data Bus Terminator with 28 terminals, operating at 0-70°C. It features a supply voltage range of 4-5.25V and pull-up resistance of 110Ω. Ideal for SCSI bus termination applications due to its nickel palladium gold finish and J bend terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,412 parts In-Stock

1+ parts

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7,412

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Sinequanon

UK . 4,100 parts In-Stock

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4,100

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Digiode

USA . 2,264 parts In-Stock

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2,264

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 219 parts In-Stock

1+ parts

$6.135

100+ parts

-

1k+ parts

$6.904

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219

$6.135

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$6.904

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DigiPath Technology Company

USA . 6 parts In-Stock

1+ parts

$6.755

100+ parts

$6.215

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-

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6

$6.755

$6.215

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ChromeModa Solutions

Germany . 3,801 parts In-Stock

1+ parts

$6.893

100+ parts

$5.652

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3,801

$6.893

$5.652

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IDEA Electronic Components Group

UK . 838 parts In-Stock

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$6.893

100+ parts

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$6.204

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838

$6.893

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$6.204

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One Stop Electronics

USA . 458 parts In-Stock

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$18.500

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458

$18.500

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AZTECH Wire

Italy . 776 parts In-Stock

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$19.350

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776

$19.350

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Corphita

USA . 1,750 parts In-Stock

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1,750

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Overview

Enhance your data bus performance with the UC5601QPR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The UC5601QPR is a versatile data bus terminator suitable for a wide range of applications. With features like a maximum supply voltage of 5.25V and a nickel palladium gold terminal finish, this chip carrier package offers exceptional value to customers. Experience seamless connectivity and improved data transmission with the UC5601QPR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for electronic components, making the product long-lasting.

Surface Mount: YES

Allows for easy installation and compact design, saving space on circuit boards.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, providing flexibility in usage scenarios.

No. of Terminals: 28

Offers multiple connection points for various signal lines, increasing connectivity options.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without performance degradation.

Nominal Pull Up Resistance: 110 ohm

Provides the right amount of resistance for optimal signal transmission and termination.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and efficiency in data communication.

Technical Specifications

Data Bus Terminators UC5601QPR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e4

Length:

11.505 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

UC5601QPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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