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UC5601DWP

Texas Instruments

UC5601DWP by Texas Instruments

UC5601DWP by Texas Instruments is a SCSI bus terminator with 28 terminals, operating at 0-70°C. It has a supply voltage range of 4-5.25V and uses bipolar technology. With a compact rectangular package style, it is ideal for data bus termination applications.

Median Price

$6.860

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,371 parts In-Stock

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-

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$5.940

1k+ parts

$5.310

10k+ parts

$5.000

2,371

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$5.940

$5.310

$5.000

DigiKey

USA . 2,371 parts In-Stock

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$6.860

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2,371

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$6.860

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Verical

USA . 470 parts In-Stock

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$7.425

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$6.638

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$6.250

470

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$7.425

$6.638

$6.250

Distributors (In-Stock)

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TEDSS.com

USA . 705 parts In-Stock

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$5.500

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$4.780

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$5.500

$4.780

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Digiode

USA . 854 parts In-Stock

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$6.270

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$6.270

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Vyrian

USA . 928 parts In-Stock

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American Microsemiconductor Inc.

USA . 12 parts In-Stock

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$6.670

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MRC Electronics

USA . 40,690 parts In-Stock

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DigiKey Marketplace

USA . 2,371 parts In-Stock

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Maverick Electronics, Inc.

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Q Components

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ACDS - Activité Composants Distribution Service

France . 538 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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384

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Prism Electronics

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R&J Components

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Inventory MP

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60

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 58 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 52 parts In-Stock

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PC Components Company LLC

USA . 27 parts In-Stock

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J & M Industries LLC

USA . 10 parts In-Stock

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10

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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10

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Mil-Aero Solutions, Inc.

USA . 6 parts In-Stock

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Semi Source

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Manoshevitz Elec. Sales

Israel . 2 parts In-Stock

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Sinequanon

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Corphita

USA . 79 parts In-Stock

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$5.940

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Parana Technologies

USA . 362 parts In-Stock

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$13.336

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$13.848

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362

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DigiPath Technology Company

USA . 874 parts In-Stock

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$14.684

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874

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ChromeModa Solutions

Germany . 900 parts In-Stock

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$14.984

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$12.287

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$14.984

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IDEA Electronic Components Group

UK . 95 parts In-Stock

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$14.984

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$14.235

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$13.486

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$13.486

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QUARKTWIN TECHNOLOGY LTD

USA . 29,384 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Kepictronics

USA . 3,850 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 2,534 parts In-Stock

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GreenTree Electronics

Israel . 991 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 662 parts In-Stock

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A-Plus Industry Inc.

USA . 16 parts In-Stock

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Overview

Enhance your data bus systems with the UC5601DWP by Texas Instruments, a high-quality SCSI bus terminator designed to optimize signal integrity and system performance. Manufactured with precision and reliability in mind, this small outline package offers dual terminal position, nickel palladium gold finish, and a commercial temperature grade for seamless integration into various applications. Ensure smooth data transmission with its 18 signal lines and nominal pull-up resistance of 110 ohms. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and adds exceptional value to your projects. Elevate your data bus systems today with the UC5601DWP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components.

Surface Mount: YES

Being surface mountable makes it easy to integrate this terminator into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.25 V

This high maximum supply voltage allows for a wide operating range, making it compatible with various systems and applications.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor for easy installation and compatibility with existing designs.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance in diverse environmental conditions.

Maximum Seated Height: 2.65 mm

The low seated height allows for compact packaging and efficient use of space in tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

This spec indicates the product's ability to withstand reflow processes, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this terminator can endure the heat stress of reflow soldering without damage.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this terminator meets industry standards for performance and reliability in typical operating environments.

No. of Signal Lines: 18

With 18 signal lines, this terminator can support complex data bus configurations and ensure smooth communication between devices.

Technical Specifications

Data Bus Terminators UC5601DWP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

UC5601DWP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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