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UCC5681PW28G4

Texas Instruments

UCC5681PW28G4 by Texas Instruments

UCC5681PW28G4 by Texas Instruments is a data bus terminator with 28 terminals. It operates at temperatures from 0 to 70°C and has power supplies of 3/5V. This surface-mount device in a small outline package is ideal for commercial applications requiring dual terminal positions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,631 parts In-Stock

1+ parts

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6,631

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Digiode

USA . 4,578 parts In-Stock

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4,578

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,487 parts In-Stock

1+ parts

$3.199

100+ parts

-

1k+ parts

$3.721

10k+ parts

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1,487

$3.199

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$3.721

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DigiPath Technology Company

USA . 1,182 parts In-Stock

1+ parts

$3.522

100+ parts

$3.240

1k+ parts

-

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1,182

$3.522

$3.240

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ChromeModa Solutions

Germany . 6,810 parts In-Stock

1+ parts

$3.594

100+ parts

$2.947

1k+ parts

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6,810

$3.594

$2.947

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IDEA Electronic Components Group

UK . 1,817 parts In-Stock

1+ parts

$3.594

100+ parts

-

1k+ parts

$3.235

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1,817

$3.594

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$3.235

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One Stop Electronics

USA . 1,447 parts In-Stock

1+ parts

$18.500

100+ parts

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1,447

$18.500

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$19.782

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253

$19.782

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Corphita

USA . 2,034 parts In-Stock

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2,034

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Overview

Elevate your data bus system with the UCC5681PW28G4 by Texas Instruments. Known for their superior quality and innovation, Texas Instruments brings you a reliable solution for data bus termination. This small outline, thin profile terminator offers dual terminal positions and a commercial temperature grade, making it ideal for a wide range of applications. With Texas Instruments' reputation for excellence, you can trust that this terminator will deliver unmatched performance and reliability. Upgrade your system today and experience the benefits of cutting-edge technology with the UCC5681PW28G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making this product suitable for long-term use in various environments.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape of the package offers compatibility with standard PCB layouts, making it easy to integrate into existing circuit designs.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) increases flexibility and compatibility with a wide range of system configurations.

No. of Terminals: 28

With 28 terminals, this product can accommodate a high number of connections, making it suitable for complex data bus systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, enabling compact and efficient circuit designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand harsh environmental conditions and high temperature environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliable performance in cold environments without risk of damage.

Terminal Position: DUAL

Dual terminal positions provide flexibility in wiring configurations, allowing for easier integration into diverse system setups.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets standard temperature requirements for most industrial and consumer electronics.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections and simplified assembly, enhancing the overall reliability of the product.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635mm, this product supports high-density routing and compact PCB layouts for efficient signal transmission.

Technical Specifications

Data Bus Terminators UCC5681PW28G4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Bus Terminators

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UCC5681PW28G4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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