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UCC5606DPG4

Texas Instruments

UCC5606DPG4 by Texas Instruments

UCC5606DPG4 by Texas Instruments is a SCSI bus terminator with 16 terminals, operating at 3.3V and supporting 9 signal lines. It has a max supply voltage of 5.25V, suitable for commercial temperature grades up to 70°C. With a compact rectangular package style and gull wing terminal form, it is ideal for data bus termination applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,299 parts In-Stock

1+ parts

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3,299

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Digiode

USA . 3,211 parts In-Stock

1+ parts

-

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3,211

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$8.532

100+ parts

-

1k+ parts

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551

$8.532

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Parana Technologies

USA . 806 parts In-Stock

1+ parts

$8.959

100+ parts

-

1k+ parts

$9.629

10k+ parts

-

806

$8.959

-

$9.629

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DigiPath Technology Company

USA . 1,878 parts In-Stock

1+ parts

$9.865

100+ parts

$9.076

1k+ parts

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10k+ parts

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1,878

$9.865

$9.076

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ChromeModa Solutions

Germany . 2,876 parts In-Stock

1+ parts

$10.066

100+ parts

$8.254

1k+ parts

-

10k+ parts

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2,876

$10.066

$8.254

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$10.066

100+ parts

$9.563

1k+ parts

$9.059

10k+ parts

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1,356

$10.066

$9.563

$9.059

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One Stop Electronics

USA . 934 parts In-Stock

1+ parts

$32.500

100+ parts

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934

$32.500

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Corphita

USA . 2,394 parts In-Stock

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2,394

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Overview

Enhance your data bus systems with the UCC5606DPG4 by Texas Instruments, a top-quality SCSI bus terminator designed to optimize performance and reliability. With Texas Instruments' renowned reputation for innovation and excellence in semiconductor technology, this product guarantees superior functionality and durability. Ideal for a wide range of applications, this small outline package offers customers unmatched value and benefits, ensuring seamless operation and maximum efficiency. Upgrade your systems today with the UCC5606DPG4 and experience the difference that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable enhances the ease of installation and allows for compact designs.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources and systems.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options and ensures flexibility in system integration.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this product suitable for use in diverse environmental conditions.

Maximum Seated Height: 1.75 mm

The compact height of the product allows for space-saving installation and integration within tight spaces.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for reliability and performance in typical operating conditions.

Nominal Pull Up Resistance: 110 ohm

The specified pull-up resistance value ensures proper termination of the data bus, reducing signal reflections and interference.

No. of Signal Lines: 9

With 9 signal lines, this product provides sufficient connectivity for data transmission and communication between devices.

Technical Specifications

Data Bus Terminators UCC5606DPG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

UCC5606DPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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