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UC5605J

Texas Instruments

UC5605J by Texas Instruments

UC5605J by Texas Instruments is a SCSI bus terminator with 16 terminals, operating at 3.8-5.25V. It features a ceramic-metal package, 110 ohm pull-up resistance, and bipolar technology. Ideal for commercial applications requiring reliable data bus termination in a compact rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,990 parts In-Stock

1+ parts

-

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7,990

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Digiode

USA . 744 parts In-Stock

1+ parts

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744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 13 parts In-Stock

1+ parts

$4.414

100+ parts

-

1k+ parts

$4.836

10k+ parts

-

13

$4.414

-

$4.836

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DigiPath Technology Company

USA . 1,073 parts In-Stock

1+ parts

$4.861

100+ parts

-

1k+ parts

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10k+ parts

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1,073

$4.861

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ChromeModa Solutions

Germany . 3,642 parts In-Stock

1+ parts

$4.960

100+ parts

$4.067

1k+ parts

-

10k+ parts

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3,642

$4.960

$4.067

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

1+ parts

$4.960

100+ parts

-

1k+ parts

$4.464

10k+ parts

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2,285

$4.960

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$4.464

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AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$8.815

100+ parts

-

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404

$8.815

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One Stop Electronics

USA . 1,446 parts In-Stock

1+ parts

$43.500

100+ parts

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1,446

$43.500

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Corphita

USA . 544 parts In-Stock

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544

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Overview

Unleash the power of seamless data transmission with the Texas Instruments UC5605J, a top-of-the-line Data Bus Terminator. Crafted with precision and expertise by one of the most trusted names in the industry, this product guarantees unparalleled quality and reliability. From ensuring smooth communication between devices to enhancing system efficiency, the UC5605J is the ultimate solution for all your data bus termination needs. Say goodbye to connectivity issues and hello to seamless performance with this innovative product from Texas Instruments. Elevate your technology experience today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and protection, ensuring the product can withstand harsh environmental conditions.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this terminator can handle power surges and fluctuations effectively.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to install and fit into standard setups without any space constraints.

Power Supplies (V): 5

Operating at a standard power supply of 5 volts makes it compatible with a wide range of systems and devices.

No. of Terminals: 16

Having 16 terminals allows for efficient connectivity and signal transmission within the data bus system.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and integration into existing data bus configurations.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this terminator can function reliably even in hot environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures consistent performance in varying climate conditions.

No. of Signal Lines: 9

Having 9 signal lines allows for effective data transmission and communication within the data bus system.

Nominal Supply Voltage: 4.75 V

The nominal supply voltage of 4.75 volts ensures efficient power consumption and compatibility with various devices.

Technical Specifications

Data Bus Terminators UC5605J attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-CDIP-T16

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

UC5605J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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