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UC5601DWPTRG4

Texas Instruments

UC5601DWPTRG4 by Texas Instruments

UC5601DWPTRG4 by Texas Instruments is a Data Bus Terminator with 28 terminals, operating at 0-70°C. It features a supply voltage range of 4-5.25V and pull-up resistance of 110Ω. Ideal for SCSI bus termination applications due to its bipolar technology and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,684 parts In-Stock

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Digiode

USA . 2,484 parts In-Stock

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AZTECH Wire

Italy . 207 parts In-Stock

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$5.892

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Parana Technologies

USA . 844 parts In-Stock

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$11.194

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$11.635

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DigiPath Technology Company

USA . 604 parts In-Stock

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$12.325

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ChromeModa Solutions

Germany . 6,824 parts In-Stock

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$12.577

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$10.313

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IDEA Electronic Components Group

UK . 2,362 parts In-Stock

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$12.577

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$11.948

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$11.319

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One Stop Electronics

USA . 1,336 parts In-Stock

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$25.500

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Corphita

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Microchip USA

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Overview

Enhance your data bus system with the high-quality UC5601DWPTRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable products that meet the highest standards. The UC5601DWPTRG4 falls under the category of Data Bus Terminators, offering seamless integration and optimal performance. With its advanced technology and durable construction, this product ensures stability and efficiency in various applications. Trust Texas Instruments to provide you with exceptional value and benefits, making your data bus system more robust and reliable. Upgrade to the UC5601DWPTRG4 today for unparalleled advantages in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 5.25 V

Can handle a wide range of supply voltages for compatibility.

Package Shape: RECTANGULAR

Compact shape for efficient use of space on the board.

Power Supplies (V): 5

Standard power supply voltage for compatibility with other components.

No. of Terminals: 28

Provides multiple connection points for signal lines.

Minimum Supply Voltage: 4 V

Ensures stable operation even at lower voltages.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures for reliable performance.

Minimum Operating Temperature: 0 °C

Suitable for operation in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures good contact conductivity.

Maximum Seated Height: 2.65 mm

Low profile design for space-constrained applications.

Width: 7.5 mm

Compact width for efficient utilization of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during soldering without damage.

Length: 17.9 mm

Optimal length for fitting into various circuit board designs.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Nominal Pull Up Resistance: 110 ohm

Provides proper termination for signal lines in data bus connections.

Technology: BIPOLAR

Utilizes bipolar technology for reliable signal processing.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and robust connections.

No. of Signal Lines: 18

Supports multiple signal lines for data transmission.

Nominal Supply Voltage: 4.75 V

Stable supply voltage for consistent operation.

Terminal Pitch: 1.27 mm

Suitable pitch for easy connections and compact design.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for standard handling precautions.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus terminator applications.

Technical Specifications

Data Bus Terminators UC5601DWPTRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

UC5601DWPTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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