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UCC5687PMTR

Texas Instruments

UCC5687PMTR by Texas Instruments

UCC5687PMTR by Texas Instruments is a Data Bus Terminator with 64 terminals, operating at 2.7-5.25 V. It features a BICMOS technology, GULL WING terminal form, and SCSI BUS TERMINATOR interface IC type. This component is ideal for applications requiring differential output and a nominal pull-up resistance of 105 ohm in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,860 parts In-Stock

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Digiode

USA . 4,014 parts In-Stock

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4,014

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Distributors (Availability)

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AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$10.234

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477

$10.234

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One Stop Electronics

USA . 846 parts In-Stock

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$11.500

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846

$11.500

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Parana Technologies

USA . 887 parts In-Stock

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$11.963

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$12.370

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887

$11.963

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$12.370

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DigiPath Technology Company

USA . 1,810 parts In-Stock

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$13.173

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1,810

$13.173

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ChromeModa Solutions

Germany . 2,106 parts In-Stock

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$13.442

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$11.022

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2,106

$13.442

$11.022

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IDEA Electronic Components Group

UK . 422 parts In-Stock

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$13.442

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$12.770

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$12.098

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422

$13.442

$12.770

$12.098

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A-Z Elektronik GmbH

Germany . 6,128 parts In-Stock

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Corphita

USA . 1,682 parts In-Stock

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Overview

Enhance the performance and reliability of your data bus systems with the UCC5687PMTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and cutting-edge technology in every product they create. The UCC5687PMTR is a versatile data bus terminator that ensures smooth and efficient communication between devices. With a wide range of applications, this product offers unmatched value and benefits to customers looking for high-performance solutions. Trust Texas Instruments to deliver excellence in every aspect of your electronic design projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the data bus terminator, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the data bus terminator onto a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage capability ensures compatibility with a wide range of systems and applications, making this data bus terminator a versatile choice.

No. of Terminals: 64

With a high number of terminals, this data bus terminator can accommodate multiple connections and signals, making it suitable for complex data bus systems.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows this data bus terminator to function reliably in a variety of environmental conditions, enhancing its versatility and reliability.

Differential Output: YES

Having a differential output helps to minimize signal interference and noise, resulting in a more accurate and stable data transmission, making this product a reliable choice for data bus applications.

Technical Specifications

Data Bus Terminators UCC5687PMTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

UCC5687PMTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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