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UCC5614DPTRG4

Texas Instruments

UCC5614DPTRG4 by Texas Instruments

UCC5614DPTRG4 by Texas Instruments is a SCSI bus terminator with 16 terminals, operating voltage range of 2.7V to 5.25V, and BICMOS technology. It has a small outline package style, GULL WING terminal form, and nominal pull-up resistance of 110 ohm. Ideal for commercial temperature grade applications requiring data bus termination.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,217 parts In-Stock

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6,217

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Digiode

USA . 3,244 parts In-Stock

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3,244

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Distributors (Availability)

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One Stop Electronics

USA . 1,569 parts In-Stock

1+ parts

$1.500

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1,569

$1.500

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Parana Technologies

USA . 147 parts In-Stock

1+ parts

$5.167

100+ parts

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$5.768

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147

$5.167

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$5.768

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ChromeModa Solutions

Germany . 6,979 parts In-Stock

1+ parts

$5.806

100+ parts

$4.761

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6,979

$5.806

$4.761

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IDEA Electronic Components Group

UK . 1,347 parts In-Stock

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$5.806

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$5.225

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1,347

$5.806

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$5.225

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AZTECH Wire

Italy . 198 parts In-Stock

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$19.542

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198

$19.542

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DigiPath Technology Company

USA . 2,248 parts In-Stock

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$5.235

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2,248

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$5.235

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Corphita

USA . 844 parts In-Stock

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844

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Microchip USA

USA . 247 parts In-Stock

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247

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Overview

Maximize the efficiency and reliability of your data bus systems with the Texas Instruments UCC5614DPTRG4. Crafted with precision and expertise, this SCSI bus terminator offers unparalleled performance and durability. Whether you're in the automotive, industrial, or telecommunications industry, this small outline package provides a seamless integration for your applications. Experience the value of smooth data transmission and enhanced productivity with the UCC5614DPTRG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to wear and tear, making this product long-lasting.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuits.

Maximum Supply Voltage: 5.25 V

Can handle a high maximum supply voltage, providing flexibility in different power supply configurations.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy placement on a circuit board.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, making it versatile for various applications.

No. of Terminals: 16

Having 16 terminals allows for connection to multiple signal lines and power sources, enhancing functionality.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures enables usage in environments with varying temperature conditions.

Nominal Pull Up Resistance: 110 ohm

Provides optimal pull-up resistance for effective signal transmission and noise reduction.

Technology: BICMOS

Utilizing BiCMOS technology ensures high performance and efficiency in data bus termination.

Interface IC Type: SCSI BUS TERMINATOR

Designed specifically for SCSI bus termination, ensuring compatibility and reliable data transmission in SCSI systems.

Technical Specifications

Data Bus Terminators UCC5614DPTRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

UCC5614DPTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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