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UC5607J

Texas Instruments

UC5607J by Texas Instruments

UC5607J by Texas Instruments is a SCSI bus terminator with 18 signal lines. It operates b/w 0-70 °C, with supply voltage of 3.8-5.25 V and pull-up resistance of 110 ohm. Ideal for commercial applications requiring precise data bus termination.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,202 parts In-Stock

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4,202

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Digiode

USA . 1,942 parts In-Stock

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1,942

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Distributors (Availability)

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Parana Technologies

USA . 1,026 parts In-Stock

1+ parts

$7.141

100+ parts

-

1k+ parts

$7.654

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1,026

$7.141

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$7.654

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ChromeModa Solutions

Germany . 5,121 parts In-Stock

1+ parts

$8.024

100+ parts

$6.580

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5,121

$8.024

$6.580

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IDEA Electronic Components Group

UK . 987 parts In-Stock

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$8.024

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$7.222

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987

$8.024

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$7.222

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AZTECH Wire

Italy . 603 parts In-Stock

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$12.036

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603

$12.036

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One Stop Electronics

USA . 754 parts In-Stock

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$20.500

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754

$20.500

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Corphita

USA . 1,835 parts In-Stock

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1,835

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DigiPath Technology Company

USA . 1,655 parts In-Stock

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$7.234

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1,655

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$7.234

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Overview

Elevate your data bus performance with the UC5607J by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. The UC5607J is a versatile data bus terminator suitable for a wide range of applications. With its advanced technology and commercial-grade temperature grade, this product ensures reliability and efficiency. Experience seamless connectivity and optimal signal transmission with the UC5607J, providing unmatched value and benefits to customers seeking high-performance solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability in various environmental conditions, making this product a good choice for long-term use.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V allows for compatibility with a wide range of systems, increasing the versatility of this product.

No. of Terminals: 24

With 24 terminals, this product offers ample connectivity options, making it suitable for complex data bus systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in harsh operating conditions, enhancing the robustness of this product.

Nominal Pull Up Resistance: 110 ohm

The nominal pull-up resistance of 110 ohm helps in maintaining signal integrity and accuracy, making this product a reliable choice for data bus termination.

Technical Specifications

Data Bus Terminators UC5607J attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-GDIP-T24

Length:

30.985 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

UC5607J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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