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UCC5619FQP

Texas Instruments

UCC5619FQP by Texas Instruments

UCC5619FQP by Texas Instruments is a SCSI bus terminator with 27 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70°C, with a supply voltage range of 4-7V. This BICMOS technology device comes in a low-profile flatpack package suitable for commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,903 parts In-Stock

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Digiode

USA . 4,928 parts In-Stock

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4,928

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 700 parts In-Stock

1+ parts

$12.963

100+ parts

-

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$13.455

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700

$12.963

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$13.455

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DigiPath Technology Company

USA . 1,332 parts In-Stock

1+ parts

$14.274

100+ parts

$13.132

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1,332

$14.274

$13.132

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ChromeModa Solutions

Germany . 6,814 parts In-Stock

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$14.565

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$11.943

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6,814

$14.565

$11.943

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IDEA Electronic Components Group

UK . 521 parts In-Stock

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$14.565

100+ parts

$13.837

1k+ parts

$13.108

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521

$14.565

$13.837

$13.108

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AZTECH Wire

Italy . 676 parts In-Stock

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$18.565

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676

$18.565

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One Stop Electronics

USA . 1,506 parts In-Stock

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$23.500

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$23.500

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Corphita

USA . 2,737 parts In-Stock

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Overview

Discover the cutting-edge UCC5619FQP by Texas Instruments, a top-of-the-line Data Bus Terminator that sets the standard for quality and reliability. Manufactured with precision and expertise, this product is designed to excel in various applications within the technology industry. With its advanced features and unparalleled performance, the UCC5619FQP offers customers exceptional value, benefits, and advantages that will elevate their projects to new heights. Trust Texas Instruments to provide you with innovative solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is resistant to wear and tear, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable makes installation of this product quick and easy, saving time and effort during setup.

Maximum Supply Voltage: 7 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in different operating environments.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration with other components in a circuit.

Power Supplies (V): 4.75

The power supply of 4.75V ensures stable and consistent performance of the product, leading to reliable data transmission.

No. of Terminals: 48

Having a high number of terminals allows for versatile connectivity options, making it suitable for complex data bus systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design of the package makes it space-efficient and suitable for compact electronic devices.

Minimum Supply Voltage: 4 V

The minimum supply voltage of 4V ensures that the product can operate with low power sources, making it energy-efficient.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising its performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the product can function effectively even in cold environments.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity options and flexibility in wiring configurations.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for a compact and streamlined design, suitable for space-constrained applications.

Width: 7 mm

The compact width of 7mm makes this product suitable for use in tight spaces where size constraints are a concern.

Length: 7 mm

The short length of 7mm further enhances the space-efficiency of the product, making it ideal for compact electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this product meets industry standards for reliability and performance in typical operating conditions.

Nominal Pull Up Resistance: 110 ohm

The nominal pull up resistance of 110 ohm helps in maintaining signal integrity and reducing noise in data bus communication.

Technology: BICMOS

The BICMOS technology used in this product combines the benefits of bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form makes soldering easy and secure, ensuring robust connections for reliable data transmission.

No. of Signal Lines: 27

The 27 signal lines provide ample connectivity options for transmitting data signals, making this product suitable for data-intensive applications.

Nominal Supply Voltage: 4.75 V

The nominal supply voltage of 4.75V ensures optimal performance and compatibility with a wide range of power sources.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density packaging and efficient use of PCB space, ideal for compact designs.

Interface IC Type: SCSI BUS TERMINATOR

The SCSI bus terminator interface IC type ensures compatibility with SCSI bus systems, making this product a suitable choice for SCSI-based applications.

Technical Specifications

Data Bus Terminators UCC5619FQP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.75

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

UCC5619FQP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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