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MCCS142239D

Onsemi

MCCS142239D by Onsemi

MCCS142239D by Onsemi is a Data Bus Terminator with 16 terminals, operating voltage range of 3.9-5.25V, and pull-up resistance of 118 ohm. It is a SCSI bus terminator suitable for commercial temperature grade applications in surface-mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,163 parts In-Stock

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Vyrian

USA . 530 parts In-Stock

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530

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Problanco Electronics

Mexico . 5,940 parts In-Stock

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5,940

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SupplyDigital Components

Austria . 4,022 parts In-Stock

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TANS Electronics

Latvia . 3,606 parts In-Stock

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Kulean Microsystems

USA . 2,704 parts In-Stock

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Corphita

USA . 2,095 parts In-Stock

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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Corohmni

South Africa . 183 parts In-Stock

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Overview

Enhance your data bus systems with the MCCS142239D by Onsemi, a top-tier manufacturer known for quality and reliability. As a leader in the industry of data bus terminators, this product offers unmatched performance and durability. With applications ranging from automotive to industrial sectors, this small outline package is versatile and efficient. Experience seamless communication and optimal signal transmission with a maximum supply voltage of 5.25V and a nominal pull up resistance of 118 ohm. Upgrade your systems today with the MCCS142239D and enjoy the value and benefits it brings to your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic components.

Surface Mount: YES

Being surface mountable, this product is easier to install and saves space on the PCB.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of power inputs.

Minimum Supply Voltage: 3.9 V

The low minimum supply voltage ensures that the product can operate efficiently even at lower power levels.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the product to function reliably even in challenging environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good electrical conductivity and solderability, ensuring a reliable connection.

No. of Signal Lines: 9

With 9 signal lines, this product can support complex data bus systems, making it versatile for different applications.

Technical Specifications

Data Bus Terminators MCCS142239D attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.9/5.25

Nominal Pull Up Resistance:

118 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.9 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MCCS142239D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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