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UCC5680PW28TRG4

Texas Instruments

UCC5680PW28TRG4 by Texas Instruments

UCC5680PW28TRG4 by Texas Instruments is a SCSI bus terminator with 28 terminals and a supply voltage range of 2.7V to 5.25V. It features a small outline package style, differential output, and nickel palladium gold terminal finish. Ideal for commercial applications requiring precise data bus termination in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,395 parts In-Stock

1+ parts

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6,395

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Digiode

USA . 3,808 parts In-Stock

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3,808

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 169 parts In-Stock

1+ parts

$4.500

100+ parts

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169

$4.500

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Parana Technologies

USA . 1,909 parts In-Stock

1+ parts

$8.879

100+ parts

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1k+ parts

$9.561

10k+ parts

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1,909

$8.879

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$9.561

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ChromeModa Solutions

Germany . 4,074 parts In-Stock

1+ parts

$9.976

100+ parts

$8.180

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4,074

$9.976

$8.180

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IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$9.976

100+ parts

$9.477

1k+ parts

$8.978

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1,245

$9.976

$9.477

$8.978

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AZTECH Wire

Italy . 639 parts In-Stock

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$10.172

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639

$10.172

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DigiPath Technology Company

USA . 1,439 parts In-Stock

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$8.994

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1,439

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$8.994

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Corphita

USA . 323 parts In-Stock

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323

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Overview

Discover the ultimate solution for data bus termination with the UCC5680PW28TRG4 by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unparalleled performance in a compact package. Ideal for a wide range of applications, this data bus terminator ensures seamless communication and efficiency. Trust in Texas Instruments to deliver reliability and innovation in every product, providing you with the value and benefits you need for your projects. Elevate your designs with the UCC5680PW28TRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for easy handling and installation.

Surface Mount: YES

Allows for easy mounting on PCBs without the need for additional hardware, saving space and simplifying the design.

Maximum Supply Voltage: 5.25 V

Ensures compatibility with a wide range of power sources for optimal performance.

Package Shape: RECTANGULAR

Facilitates a compact and standardized form factor for easy integration into various systems.

Power Supplies (V): 3/5

Supports multiple power supply options for versatility in different applications.

No. of Terminals: 28

Provides ample connectivity options for robust signal transmission and communication.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Offers a space-saving design with efficient heat dissipation for improved reliability.

Minimum Supply Voltage: 2.7 V

Allows for operation in low power scenarios while maintaining performance.

Maximum Operating Temperature: 70 °C

Ensures reliable operation in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Suitable for use in various temperature conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Offers redundancy and improved signal integrity for stable data transmission.

Maximum Seated Height: 1.2 mm

Enables a low-profile design for installations with height constraints.

Width: 4.4 mm

Compact width allows for tight spacing on PCBs and efficient use of board real estate.

Differential Output: YES

Supports high-speed data transmission with improved noise immunity and signal quality.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and mounting during assembly for reliable performance.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes while maintaining component integrity.

Length: 9.7 mm

Optimal length for compact installations and efficient signal routing.

Temperature Grade: COMMERCIAL

Designed for standard commercial operating conditions for wide applicability.

Nominal Pull Up Resistance: 105 ohm

Provides the correct impedance for signal termination and reflection control.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connections for reliable performance.

No. of Signal Lines: 9

Supports multiple signal lines for versatile data communication and transmission.

Terminal Pitch: 0.65 mm

Ensures precise alignment and spacing for optimal signal integrity and performance.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination applications, ensuring compatibility and performance.

Technical Specifications

Data Bus Terminators UCC5680PW28TRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

UCC5680PW28TRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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