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UCC5646FQP

Texas Instruments

UCC5646FQP by Texas Instruments

UCC5646FQP by Texas Instruments is a Data Bus Terminator with 64 terminals, operating voltage range of 2.7V to 5.25V, and temperature range of 0°C to 70°C. It features a low profile flatpack package style suitable for SCSI bus terminations, offering differential outputs and nominal pull-up resistance of 125Ω.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,660 parts In-Stock

1+ parts

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8,660

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Digiode

USA . 248 parts In-Stock

1+ parts

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248

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 462 parts In-Stock

1+ parts

$8.088

100+ parts

$751.123

1k+ parts

$7.279

10k+ parts

-

462

$8.088

$751.123

$7.279

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DigiPath Technology Company

USA . 258 parts In-Stock

1+ parts

$8.906

100+ parts

-

1k+ parts

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258

$8.906

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IDEA Electronic Components Group

UK . 1,070 parts In-Stock

1+ parts

$9.088

100+ parts

$8.634

1k+ parts

$8.179

10k+ parts

-

1,070

$9.088

$8.634

$8.179

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ChromeModa Solutions

Germany . 383 parts In-Stock

1+ parts

$9.088

100+ parts

$7.452

1k+ parts

-

10k+ parts

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383

$9.088

$7.452

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AZTECH Wire

Italy . 383 parts In-Stock

1+ parts

$12.820

100+ parts

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383

$12.820

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One Stop Electronics

USA . 220 parts In-Stock

1+ parts

$49.500

100+ parts

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220

$49.500

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Corphita

USA . 321 parts In-Stock

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321

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Overview

Experience the quality and reliability of Texas Instruments with the UCC5646FQP data bus terminator. This innovative product offers superior performance in a compact package, making it ideal for a wide range of applications. From ensuring signal integrity to optimizing system efficiency, this terminator provides unmatched value and benefits to customers. Trust Texas Instruments to deliver cutting-edge technology that meets your needs with the UCC5646FQP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making this product reliable for long-term use.

Surface Mount: YES

The surface mount feature enables easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

This high maximum supply voltage ensures compatibility with a wide range of electronic devices, offering versatility in usage.

Package Shape: SQUARE

The square shape of the package allows for efficient utilization of space on the PCB, contributing to a compact and streamlined design.

No. of Terminals: 64

With 64 terminals, this product provides ample connectivity options for integrating multiple devices and components in a system.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures energy efficiency and compatibility with devices that operate on lower power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions, making this product suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this product can function effectively even in colder environments, increasing its versatility.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection on the PCB, reducing the risk of signal interference and ensuring consistent performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height contributes to a slim and compact design, ideal for applications where space is limited.

Width: 10 mm

The 10mm width offers a balance between compactness and usability, making this product suitable for a variety of electronic systems.

Differential Output: YES

The differential output feature helps in reducing signal distortion and noise, ensuring reliable data transmission in high-speed applications.

Length: 10 mm

The 10mm length contributes to a compact form factor, making this product suitable for applications where space is a constraint.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product meets industry standards for performance and reliability in typical commercial environments.

Nominal Pull Up Resistance: 125 ohm

The 125 ohm nominal pull up resistance helps in ensuring proper signal termination, reducing reflections and signal integrity issues.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and a secure connection, enhancing the overall reliability of the product.

No. of Signal Lines: 27

With 27 signal lines, this product offers versatility in connectivity options, allowing for the integration of multiple devices and peripherals in a system.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density packing of components on the PCB, optimizing space utilization and enhancing design flexibility.

Interface IC Type: SCSI BUS TERMINATOR

The SCSI bus terminator interface IC type ensures compatibility with SCSI bus systems, making this product a suitable choice for SCSI-based applications.

Technical Specifications

Data Bus Terminators UCC5646FQP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Nominal Pull Up Resistance:

125 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

UCC5646FQP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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