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UCC5672MWPG4

Texas Instruments

UCC5672MWPG4 by Texas Instruments

UCC5672MWPG4 by Texas Instruments is a SCSI bus terminator with 36 terminals, operating voltage range of 2.7V to 5.25V, and BICMOS technology. It features a nominal pull-up resistance of 105 ohm, differential output, and small outline package style for commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,784 parts In-Stock

1+ parts

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4,784

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Vyrian

USA . 3,853 parts In-Stock

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3,853

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 229 parts In-Stock

1+ parts

$8.782

100+ parts

-

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229

$8.782

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Parana Technologies

USA . 1,781 parts In-Stock

1+ parts

$10.795

100+ parts

-

1k+ parts

$11.276

10k+ parts

-

1,781

$10.795

-

$11.276

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ChromeModa Solutions

Germany . 6,020 parts In-Stock

1+ parts

$12.129

100+ parts

$9.946

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-

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6,020

$12.129

$9.946

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IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$12.129

100+ parts

$11.523

1k+ parts

$10.916

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-

2,140

$12.129

$11.523

$10.916

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Modulus Dynamics

Lithuania . 5 parts In-Stock

1+ parts

$14.185

100+ parts

$14.185

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$14.185

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5

$14.185

$14.185

$14.185

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One Stop Electronics

USA . 827 parts In-Stock

1+ parts

$18.500

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827

$18.500

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DigiPath Technology Company

USA . 1,803 parts In-Stock

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$10.936

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1,803

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$10.936

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Corphita

USA . 995 parts In-Stock

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995

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Overview

Unleash the power of seamless data transmission with the UCC5672MWPG4 by Texas Instruments. Crafted with precision and reliability, this data bus terminator is designed to deliver unmatched performance in a variety of applications. From ensuring smooth communication in SCSI buses to optimizing signal integrity, this product offers unparalleled value and benefits to customers. Trust in Texas Instruments' legacy of excellence and elevate your projects with the quality and advantages of the UCC5672MWPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easily mountable on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, providing flexibility in different power scenarios.

Minimum Supply Voltage: 2.7 V

Can operate effectively even at lower supply voltages, ensuring consistent performance.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating environments.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for efficient signal transmission and connectivity.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and optimal performance.

Technical Specifications

Data Bus Terminators UCC5672MWPG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e4

Length:

15.385 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

UCC5672MWPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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