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SA16B6

STMicroelectronics

SA16B6 by STMicroelectronics

SA16B6 by STMicroelectronics is a dual-terminal diode bus termination array designed for industrial applications. It features a compact 20-terminal package with a max operating temp of 85 °C and supports 16 signal lines. Ideal for reliable data communication in harsh environments, it ensures optimal performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,379

-

-

-

-

Anansix

USA . 734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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734

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Digiode

USA . 623 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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623

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 60 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

$1.953

10k+ parts

-

60

$2.170

-

$1.953

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MKK Technologies

India . 692 parts In-Stock

1+ parts

$4.081

100+ parts

-

1k+ parts

-

10k+ parts

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692

$4.081

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DigiPath Technology Company

USA . 692 parts In-Stock

1+ parts

$4.081

100+ parts

-

1k+ parts

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10k+ parts

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692

$4.081

-

-

-

Parana Technologies

USA . 375 parts In-Stock

1+ parts

-

100+ parts

$2.595

1k+ parts

-

10k+ parts

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375

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$2.595

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Corphita

USA . 305 parts In-Stock

1+ parts

-

100+ parts

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305

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Overview

Unlock reliable performance with the SA16B6 from STMicroelectronics, a trusted leader in semiconductor solutions. This advanced data bus terminator ensures seamless signal integrity across various industrial applications, from automotive systems to automation equipment. With its robust design and superior temperature resilience, customers benefit from enhanced durability and efficiency, making it an essential choice for demanding environments. Boost your projects with quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and robust performance in various environmental conditions.

Surface Mount: YES

Surface mount capability facilitates easy integration into modern PCB designs, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for efficient layout planning on circuit boards, maximizing space utilization.

No. of Terminals: 20

With 20 terminals, the product offers ample connectivity options for complex applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline package style with shrink pitch is ideal for high-density layouts, accommodating advanced electronic designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance under demanding thermal conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme environments and industrial applications.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and promotes long-term reliability in electronic connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB layouts, providing flexibility in circuit design.

Maximum Seated Height: 2 mm

A low maximum seated height of 2 mm helps maintain a streamlined profile on PCBs, which is beneficial for compact devices.

Width: 6.1 mm

With a width of 6.1 mm, this component fits well in narrow spaces, accommodating compact electronic assemblies.

Length: 7.55 mm

A length of 7.55 mm allows for a balance between performance and space efficiency, making it easy to integrate into various designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product offers reliability in harsh environments, ensuring longevity and performance.

Terminal Form: GULL WING

The gull wing terminal form simplifies automated soldering processes, enhancing assembly speed and consistency.

No. of Signal Lines: 16

Supporting 16 signal lines, this product enables effective signal routing, which is critical for high-performance applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for tight packing of components, thereby optimizing PCB space usage.

Interface IC Type: DIODE BUS TERMINATION ARRAY

As a diode bus termination array, this IC type provides efficient signal integrity, reducing reflections and improving overall performance.

Technical Specifications

Data Bus Terminators SA16B6 attributes and parameters. Explore more Data Bus Terminators devices from STMicroelectronics

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

7.55 mm

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

SA16B6 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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