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UC5641PW24

Texas Instruments

UC5641PW24 by Texas Instruments

UC5641PW24 by Texas Instruments is a 24-terminal Data Bus Terminator with 3.3V supply, operating b/w 0-70°C. It features Gull Wing terminals, Bipolar technology, and is surface-mountable. Ideal for commercial applications requiring a compact, high-performance solution in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,552 parts In-Stock

1+ parts

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100+ parts

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3,552

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Digiode

USA . 162 parts In-Stock

1+ parts

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162

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 852 parts In-Stock

1+ parts

$1.500

100+ parts

-

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852

$1.500

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Parana Technologies

USA . 1,903 parts In-Stock

1+ parts

$7.383

100+ parts

-

1k+ parts

$7.875

10k+ parts

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1,903

$7.383

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$7.875

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DigiPath Technology Company

USA . 964 parts In-Stock

1+ parts

$8.129

100+ parts

$7.479

1k+ parts

-

10k+ parts

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964

$8.129

$7.479

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IDEA Electronic Components Group

UK . 779 parts In-Stock

1+ parts

$8.295

100+ parts

$7.880

1k+ parts

$7.466

10k+ parts

-

779

$8.295

$7.880

$7.466

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ChromeModa Solutions

Germany . 575 parts In-Stock

1+ parts

$8.295

100+ parts

$6.802

1k+ parts

-

10k+ parts

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575

$8.295

$6.802

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AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$16.360

100+ parts

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365

$16.360

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Corphita

USA . 2,480 parts In-Stock

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2,480

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Overview

Looking to enhance the performance of your data bus system? Look no further than the UC5641PW24 by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers once again with this data bus terminator. Ideal for a range of applications, this product offers unmatched reliability and efficiency. Say goodbye to connectivity issues and hello to seamless data transmission with the UC5641PW24. Trust in Texas Instruments for all your electronic component needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the data bus terminator.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Works efficiently with a voltage of 3.3V, ensuring compatibility with a wide range of systems.

No. of Terminals: 24

Offers a sufficient number of terminals for connecting to various components and devices in the system.

Maximum Operating Temperature: 70 °C

Can operate effectively in high-temperature environments without risk of overheating.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions, providing reliability in a variety of environments.

Technology: BIPOLAR

Utilizes bipolar technology for efficient signal processing and transmission within the data bus system.

Nominal Supply Voltage: 3.3 V

Optimized for a supply voltage of 3.3V, ensuring stable performance and compatibility.

Technical Specifications

Data Bus Terminators UC5641PW24 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Bus Terminators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UC5641PW24 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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