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UC5601DWPR

Texas Instruments

UC5601DWPR by Texas Instruments

UC5601DWPR by Texas Instruments is a SCSI bus terminator with 18 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70°C, with a supply voltage range of 4-5.25V. This small outline package is ideal for data bus termination applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,546 parts In-Stock

1+ parts

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9,546

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Digiode

USA . 3,081 parts In-Stock

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3,081

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 481 parts In-Stock

1+ parts

$2.181

100+ parts

-

1k+ parts

$2.693

10k+ parts

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481

$2.181

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$2.693

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ChromeModa Solutions

Germany . 6,744 parts In-Stock

1+ parts

$2.451

100+ parts

$2.010

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6,744

$2.451

$2.010

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IDEA Electronic Components Group

UK . 1,321 parts In-Stock

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$2.451

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$2.206

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1,321

$2.451

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$2.206

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One Stop Electronics

USA . 255 parts In-Stock

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$17.500

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255

$17.500

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AZTECH Wire

Italy . 576 parts In-Stock

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$18.963

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576

$18.963

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DigiPath Technology Company

USA . 2,106 parts In-Stock

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$2.210

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2,106

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$2.210

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Corphita

USA . 1,359 parts In-Stock

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Overview

Enhance your data bus systems with the UC5601DWPR by Texas Instruments. Known for its superior quality and reliability, Texas Instruments delivers top-notch solutions for various applications in the data bus terminator category. This innovative product offers exceptional value, providing customers with reliable performance, precise termination, and efficient signal transmission. Upgrade your systems today with the UC5601DWPR and experience the benefits of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures longevity and reliability of the product.

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuits.

No. of Terminals: 28

Sufficient terminals for connecting multiple signal lines.

Minimum Operating Temperature: 0 °C

Suitable for use in a variety of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

Dual terminal position for increased connectivity and flexibility.

Width: 7.5 mm

Compact width allows for efficient use of space on the PCB.

Length: 17.9 mm

Optimal length for easy installation and integration into the circuit.

Nominal Pull Up Resistance: 110 ohm

Provides the right amount of resistance to ensure proper signal transmission.

No. of Signal Lines: 18

Sufficient signal lines for connecting multiple devices in the network.

Nominal Supply Voltage: 4.75 V

Stable supply voltage for consistent performance of the product.

Technical Specifications

Data Bus Terminators UC5601DWPR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

UC5601DWPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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