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UC5603DPRTR

Texas Instruments

UC5603DPRTR by Texas Instruments

UC5603DPRTR by Texas Instruments is a Data Bus Terminator with 16 terminals, operating voltage range of 3.8V to 5.25V, and pull-up resistance of 110 ohm. It is a SCSI bus terminator suitable for commercial applications requiring a compact small outline package with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,832 parts In-Stock

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Digiode

USA . 1,902 parts In-Stock

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Prism Electronics

USA . 175 parts In-Stock

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175

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AZTECH Wire

Italy . 550 parts In-Stock

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$6.779

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550

$6.779

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Parana Technologies

USA . 1,743 parts In-Stock

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$8.534

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$9.192

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ChromeModa Solutions

Germany . 5,608 parts In-Stock

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$9.589

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$7.863

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5,608

$9.589

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IDEA Electronic Components Group

UK . 1,738 parts In-Stock

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$9.589

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$9.110

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$8.630

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1,738

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$8.630

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One Stop Electronics

USA . 1,535 parts In-Stock

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$18.500

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$18.500

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Component Stockers USA

USA . 643 parts In-Stock

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$99.990

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$99.990

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DigiPath Technology Company

USA . 1,217 parts In-Stock

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$8.645

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Corphita

USA . 460 parts In-Stock

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Perfect Parts

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Overview

Enhance your data bus systems with the high-quality UC5603DPRTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and efficient products like this SCSI bus terminator. Designed with precision and durability, this small outline package offers seamless integration, ensuring optimal performance in a wide range of applications. Experience the value and benefits of superior technology with the UC5603DPRTR, providing customers with the competitive edge they need to succeed. Elevate your data bus systems today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the component, making the product long-lasting.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Can handle a wide range of supply voltages, providing flexibility in different system configurations.

No. of Terminals: 16

Sufficient number of terminals for connecting to multiple signal lines and power supplies.

Minimum Operating Temperature: 0 °C

Capable of operating at lower temperatures, ensuring reliable performance in various environments.

Nominal Pull Up Resistance: 110 ohm

Provides the recommended resistance for proper termination of signal lines in the data bus, reducing reflections and signal distortion.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and optimal performance in SCSI systems.

Technical Specifications

Data Bus Terminators UC5603DPRTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

UC5603DPRTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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