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UCC5614DPTR

Texas Instruments

UCC5614DPTR by Texas Instruments

UCC5614DPTR by Texas Instruments is a SCSI bus terminator with 16 terminals and BICMOS technology. It operates b/w 0 to 70°C, with supply voltage ranging from 2.7V to 5.25V. This small outline package is ideal for data bus termination applications.

Median Price

$1.930

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$1.930

1k+ parts

$1.730

10k+ parts

$1.620

35

-

$1.930

$1.730

$1.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,053 parts In-Stock

1+ parts

$2.052

100+ parts

-

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2,053

$2.052

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Vyrian

USA . 7,853 parts In-Stock

1+ parts

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7,853

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ComSIT Distribution GmbH

Germany . 3,420 parts In-Stock

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3,420

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Prism Electronics

USA . 2,206 parts In-Stock

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2,206

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Cyclops Electronics Ltd

UK . 372 parts In-Stock

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372

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Bristol Electronics

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$1.254

1k+ parts

$1.165

10k+ parts

-

360

-

$1.254

$1.165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,619 parts In-Stock

1+ parts

$1.944

100+ parts

-

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1,619

$1.944

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Component Stockers USA

USA . 45 parts In-Stock

1+ parts

$2.190

100+ parts

-

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45

$2.190

-

-

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Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

$9.955

100+ parts

-

1k+ parts

$10.520

10k+ parts

-

1,612

$9.955

-

$10.520

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$10.961

100+ parts

$10.084

1k+ parts

-

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2,332

$10.961

$10.084

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ChromeModa Solutions

Germany . 4,647 parts In-Stock

1+ parts

$11.185

100+ parts

$9.172

1k+ parts

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4,647

$11.185

$9.172

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IDEA Electronic Components Group

UK . 2,115 parts In-Stock

1+ parts

$11.185

100+ parts

$10.626

1k+ parts

$10.066

10k+ parts

-

2,115

$11.185

$10.626

$10.066

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AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$18.640

100+ parts

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876

$18.640

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 7,263 parts In-Stock

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7,263

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Perfect Parts

USA . 2,471 parts In-Stock

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2,471

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Kepictronics

USA . 690 parts In-Stock

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690

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Microchip USA

USA . 436 parts In-Stock

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436

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Overview

Unlock seamless communication with the UCC5614DPTR by Texas Instruments. Crafted with precision and expertise, this high-quality data bus terminator offers unparalleled reliability and performance. Ideal for SCSI applications, this small outline package delivers exceptional value with its dual terminal position and 110 ohm nominal pull-up resistance. Trust Texas Instruments to provide innovative solutions that exceed expectations. Elevate your projects with the UCC5614DPTR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the data bus terminator, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this data bus terminator can handle a wide range of power inputs, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing circuit designs, providing a seamless fit within the overall system.

Power Supplies (V): 3/5

This data bus terminator is compatible with both 3V and 5V power supplies, offering flexibility for various system requirements.

No. of Terminals: 16

Having 16 terminals allows for the connection of multiple signal lines, enabling efficient data transmission and communication across the bus.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in a range of environmental conditions, making this data bus terminator suitable for various applications.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this data bus terminator can function effectively even in cold environments, offering robust performance in diverse settings.

Terminal Position: DUAL

The dual terminal position allows for secure and stable connections, reducing the risk of signal interference or loss during data transmission.

Width: 3.9 mm

The compact width of this data bus terminator enables efficient use of space on circuit boards, making it ideal for compact electronic devices or systems.

Length: 9.9 mm

The moderate length of the data bus terminator provides a balance between space-saving design and ease of integration into circuit layouts, offering versatility for various board sizes.

Technical Specifications

Data Bus Terminators UCC5614DPTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

UCC5614DPTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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