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UCC5611J

Texas Instruments

UCC5611J by Texas Instruments

UCC5611J by Texas Instruments is a SCSI bus terminator with 18 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70°C, with supply voltage range of 2.75-7V. Ideal for commercial applications requiring BICMOS technology in a ceramic package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,958 parts In-Stock

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4,958

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Digiode

USA . 820 parts In-Stock

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820

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,211 parts In-Stock

1+ parts

$5.849

100+ parts

-

1k+ parts

$6.631

10k+ parts

-

2,211

$5.849

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$6.631

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DigiPath Technology Company

USA . 361 parts In-Stock

1+ parts

$6.441

100+ parts

$5.925

1k+ parts

-

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361

$6.441

$5.925

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ChromeModa Solutions

Germany . 1,980 parts In-Stock

1+ parts

$6.572

100+ parts

$5.389

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-

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1,980

$6.572

$5.389

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IDEA Electronic Components Group

UK . 359 parts In-Stock

1+ parts

$6.572

100+ parts

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$5.915

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359

$6.572

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$5.915

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One Stop Electronics

USA . 226 parts In-Stock

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$11.500

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226

$11.500

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AZTECH Wire

Italy . 732 parts In-Stock

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$13.994

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732

$13.994

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Corphita

USA . 1,466 parts In-Stock

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Overview

Elevate your data bus terminator experience with the UCC5611J by Texas Instruments. Crafted with precision and reliability, this innovative product ensures seamless communication within your system. Designed for efficiency and performance, this gem of a device offers unparalleled value to users in various applications. Whether you're in need of a reliable SCSI bus terminator or seeking to optimize your system, the UCC5611J is your go-to solution. Trust in the quality of Texas Instruments and elevate your technological endeavors with this top-of-the-line product.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material ensures durability and protection for the internal components of the data bus terminator, making it suitable for various environments.

Maximum Supply Voltage: 7 V

The high maximum supply voltage of 7 V allows for flexibility in power input, accommodating a wide range of system requirements.

Power Supplies (V): 3/5

The multiple power supply options of 3 or 5 volts make this data bus terminator compatible with different types of systems, enhancing its versatility.

No. of Terminals: 24

With 24 terminals, this data bus terminator offers ample connectivity options, allowing for seamless integration within a system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the data bus terminator can perform reliably in various conditions without overheating.

Nominal Pull Up Resistance: 110 ohm

The nominal pull up resistance of 110 ohms helps to stabilize the signal lines and prevent interference, ensuring optimal performance of the data bus terminator.

Technical Specifications

Data Bus Terminators UCC5611J attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-GDIP-T24

Length:

31.75 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

4.91 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

2.75 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

UCC5611J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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