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UCC5631AFQPTR

Texas Instruments

UCC5631AFQPTR by Texas Instruments

UCC5631AFQPTR by Texas Instruments is a Data Bus Terminator with 48 terminals, operating at 2.7-5.25V. It features BICMOS technology, 105 ohm pull-up resistance, and supports SCSI interface applications. This low-profile flatpack IC has a quad terminal position and operates b/w 0-70°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,157 parts In-Stock

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8,157

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Digiode

USA . 5,000 parts In-Stock

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5,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,097 parts In-Stock

1+ parts

$9.249

100+ parts

-

1k+ parts

$9.885

10k+ parts

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1,097

$9.249

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$9.885

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ChromeModa Solutions

Germany . 3,400 parts In-Stock

1+ parts

$10.392

100+ parts

$8.521

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3,400

$10.392

$8.521

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$10.392

100+ parts

$9.872

1k+ parts

$9.353

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1,962

$10.392

$9.872

$9.353

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AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$12.429

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445

$12.429

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One Stop Electronics

USA . 1,549 parts In-Stock

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$16.500

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1,549

$16.500

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DigiPath Technology Company

USA . 2,350 parts In-Stock

1+ parts

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100+ parts

$9.369

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2,350

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$9.369

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Corphita

USA . 2,254 parts In-Stock

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2,254

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Overview

Enhance your data bus systems with the UCC5631AFQPTR by Texas Instruments. This high-quality SCSI bus terminator offers reliable performance in a compact package, perfect for a range of applications. With its advanced BICMOS technology and commercial temperature grade, this terminator ensures optimal signal integrity and stability. Trust Texas Instruments to deliver top-notch products that meet your needs. Upgrade your data bus systems today with the UCC5631AFQPTR and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various environments and applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.25 V

Can handle a higher supply voltage, providing flexibility in power sources and ensuring the product's reliability.

Package Shape: SQUARE

The square shape makes it easy to place and align on the circuit board, enhancing the ease of installation.

Power Supplies (V): 3/5

Supports multiple power supply options, allowing for compatibility with different systems and configurations.

No. of Terminals: 48

Having a high number of terminals enables connections with various components, enhancing the product's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures a compact design, facilitating space-saving in the overall system layout.

Minimum Supply Voltage: 2.7 V

With a low minimum supply voltage requirement, the product can operate efficiently even with limited power sources.

Maximum Operating Temperature: 70 °C

Can operate effectively in high-temperature environments, providing reliability in various working conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature settings, ensuring performance across a wide range of operating conditions.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.6 mm

The low seated height enhances the product's compactness and allows for efficient integration in tight spaces.

Width: 7 mm

A moderate width size provides a balance between space-saving and ease of handling during installation.

Differential Output: YES

Differential output helps in reducing electromagnetic interference, ensuring signal integrity and reliable data transmission.

Length: 7 mm

The short length makes the product suitable for compact designs and enables efficient placement on the circuit board.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring performance and durability in typical operating conditions.

Nominal Pull Up Resistance: 105 ohm

The specified pull-up resistance value helps in maintaining signal strength and stability in the data communication process.

Technology: BICMOS

Utilizing BiCMOS technology provides a balance between high-speed performance and low power consumption, ideal for data transmission applications.

Terminal Form: GULL WING

The gull-wing terminal form offers reliable solder connections, enhancing the product's durability and signal transmission quality.

No. of Signal Lines: 9

Having multiple signal lines allows for efficient data transmission and connectivity with various systems and components.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage ensures compatibility with standard power sources, providing stable operation.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and efficient use of space on the circuit board.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and optimal performance in SCSI-based systems.

Technical Specifications

Data Bus Terminators UCC5631AFQPTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

UCC5631AFQPTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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