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UCC5640PW24TRG4

Texas Instruments

UCC5640PW24TRG4 by Texas Instruments

UCC5640PW24TRG4 by Texas Instruments is a SCSI bus terminator with 24 terminals and a supply voltage range of 2.7V to 5.25V. It features a BICMOS technology, differential output, and nominal pull-up resistance of 105 ohm. This compact device is ideal for data bus termination applications in commercial-grade environments with operating temperatures ranging from 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,025 parts In-Stock

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7,025

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Digiode

USA . 3,933 parts In-Stock

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3,933

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,569 parts In-Stock

1+ parts

$4.500

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1,569

$4.500

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AZTECH Wire

Italy . 393 parts In-Stock

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$5.920

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393

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Parana Technologies

USA . 74 parts In-Stock

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$9.859

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$10.429

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74

$9.859

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$10.429

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ChromeModa Solutions

Germany . 4,815 parts In-Stock

1+ parts

$11.077

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$9.083

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4,815

$11.077

$9.083

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IDEA Electronic Components Group

UK . 1,653 parts In-Stock

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$11.077

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$10.523

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$9.969

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1,653

$11.077

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$9.969

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Corphita

USA . 3,595 parts In-Stock

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3,595

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DigiPath Technology Company

USA . 1,988 parts In-Stock

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$9.987

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Overview

Enhance your data bus systems with the UCC5640PW24TRG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. The UCC5640PW24TRG4 is a must-have in the category of data bus terminators, offering unmatched value and benefits to customers. With its advanced technology and superior performance, this product ensures seamless operation and optimal efficiency. Upgrade your systems today and experience the advantages that come with using Texas Instruments' innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the terminator, making it suitable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this terminator can be used in a variety of applications without the risk of damage due to voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, making it easy to integrate into electronic systems with limited space.

Power Supplies (V): 3/5

The dual power supply options allow flexibility in system design, enabling compatibility with different voltage requirements.

No. of Terminals: 24

The high number of terminals provides connectivity options for multiple signal lines, ensuring efficient data transmission.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the terminator.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the terminator to function reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the terminator can operate effectively in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission over time.

Maximum Seated Height: 1.2 mm

The low seated height makes the terminator suitable for applications where space constraints are a concern.

Differential Output: YES

The differential output helps to reduce noise and improve signal quality, making the terminator ideal for high-speed data bus applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the terminator is suitable for standard commercial operating conditions.

Nominal Pull Up Resistance: 105 ohm

The specified pull-up resistance value ensures proper termination of the data bus, preventing signal reflections and errors.

Technology: BICMOS

The use of BICMOS technology provides a combination of bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and provides mechanical strength to the connections, ensuring reliability in operation.

No. of Signal Lines: 9

The multiple signal lines allow for data bus termination of complex systems with multiple communication channels, ensuring reliable data transmission.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage ensures compatibility with standard voltage levels, making integration into existing systems seamless.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on circuit boards, optimizing space utilization and enhancing system performance.

Interface IC Type: SCSI BUS TERMINATOR

The SCSI bus terminator interface IC type ensures compatibility with SCSI bus systems, making it a suitable choice for SCSI-based applications.

Technical Specifications

Data Bus Terminators UCC5640PW24TRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

UCC5640PW24TRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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