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UCC5641PW28G4

Texas Instruments

UCC5641PW28G4 by Texas Instruments

UCC5641PW28G4 by Texas Instruments is a 3.3V Data Bus Terminator with 28 terminals in a small outline package. Operating b/w 0°C to 70°C, it utilizes BICMOS technology and Gull Wing terminal form for commercial applications requiring surface mount terminators.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,258 parts In-Stock

1+ parts

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3,258

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Digiode

USA . 895 parts In-Stock

1+ parts

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895

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$7.675

100+ parts

-

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224

$7.675

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One Stop Electronics

USA . 196 parts In-Stock

1+ parts

$8.500

100+ parts

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196

$8.500

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Parana Technologies

USA . 1,757 parts In-Stock

1+ parts

$11.880

100+ parts

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$12.276

10k+ parts

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1,757

$11.880

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$12.276

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DigiPath Technology Company

USA . 795 parts In-Stock

1+ parts

$13.081

100+ parts

$12.035

1k+ parts

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10k+ parts

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795

$13.081

$12.035

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

1+ parts

$13.348

100+ parts

$12.681

1k+ parts

$12.013

10k+ parts

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2,068

$13.348

$12.681

$12.013

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ChromeModa Solutions

Germany . 1,669 parts In-Stock

1+ parts

$13.348

100+ parts

$10.945

1k+ parts

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10k+ parts

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1,669

$13.348

$10.945

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Corphita

USA . 777 parts In-Stock

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777

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Overview

Upgrade your data bus terminators with the UCC5641PW28G4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments products are trusted by professionals worldwide. This small outline, thin profile package is perfect for a wide range of applications, offering customers the value and performance they need. Say goodbye to connectivity issues and hello to seamless data transmission with the UCC5641PW28G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easier to handle and less prone to damage during installation or handling.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape is standard and allows for easier placement on a circuit board, facilitating the overall design and layout process.

Power Supplies (V): 3.3

Operating at a standard power supply of 3.3V ensures compatibility with common voltage levels in electronic systems, making it versatile and widely usable.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options, allowing for interfacing with multiple devices or components within a system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style conserves space on a circuit board, enabling compact designs and efficient use of board real estate.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably function in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0°C ensures that the product can operate effectively even in colder environments, increasing its versatility.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connection options, enhancing the overall reliability and usability of the product.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for temperature range and performance, making it suitable for a wide range of applications.

Technology: BICMOS

Utilizing BiCMOS technology offers a blend of the advantages of both bipolar and CMOS technologies, providing improved speed, power efficiency, and noise immunity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto a circuit board, ensuring secure and reliable electrical connections for optimal performance.

Nominal Supply Voltage: 3.3V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard voltage levels in electronic systems, simplifying integration and operation.

Terminal Pitch: 0.635 mm

The tight terminal pitch of 0.635mm allows for high-density mounting on a circuit board, enabling efficient use of space and optimal connectivity.

Technical Specifications

Data Bus Terminators UCC5641PW28G4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Bus Terminators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UCC5641PW28G4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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