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SN74S1053PWG4

Texas Instruments

SN74S1053PWG4 by Texas Instruments

SN74S1053PWG4 by Texas Instruments is a Data Bus Terminator with 20 terminals, operating temperature range of 0-70°C, and supply voltage of 5V. It is used for diode bus termination arrays in commercial-grade applications. The package style is small outline, thin profile, with gull wing terminals suitable for surface mount assembly.

Median Price

$1.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 255 parts In-Stock

1+ parts

$1.750

100+ parts

$1.720

1k+ parts

$1.680

10k+ parts

-

255

$1.750

$1.720

$1.680

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,725 parts In-Stock

1+ parts

-

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8,725

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Digiode

USA . 4,711 parts In-Stock

1+ parts

-

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4,711

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-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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10

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Prism Electronics

USA . 2 parts In-Stock

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-

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 901 parts In-Stock

1+ parts

$2.209

100+ parts

-

1k+ parts

$2.716

10k+ parts

-

901

$2.209

-

$2.716

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DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

$2.432

100+ parts

-

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1,179

$2.432

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ChromeModa Solutions

Germany . 2,648 parts In-Stock

1+ parts

$2.482

100+ parts

$2.035

1k+ parts

-

10k+ parts

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2,648

$2.482

$2.035

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IDEA Electronic Components Group

UK . 391 parts In-Stock

1+ parts

$2.482

100+ parts

-

1k+ parts

$2.234

10k+ parts

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391

$2.482

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$2.234

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One Stop Electronics

USA . 1,224 parts In-Stock

1+ parts

$8.500

100+ parts

-

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1,224

$8.500

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AZTECH Wire

Italy . 523 parts In-Stock

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$12.489

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523

$12.489

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Ampacity Inc.

Singapore . 782 parts In-Stock

1+ parts

$26.500

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782

$26.500

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Corphita

USA . 4,238 parts In-Stock

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4,238

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Overview

Enhance the performance and reliability of your electronic devices with the SN74S1053PWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Data Bus Terminators that are essential for optimizing signal integrity and reducing electromagnetic interference. This compact and versatile component is designed to meet the demands of various applications, providing customers with a cost-effective solution that ensures seamless operation. Trust in Texas Instruments for cutting-edge technology that exceeds expectations and elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB.

Maximum Operating Temperature: 70 °C

Ability to operate at a maximum temperature of 70°C ensures reliable performance in various environments.

No. of Signal Lines: 16

With 16 signal lines, this product can handle a high volume of data transmissions efficiently.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems.

Technical Specifications

Data Bus Terminators SN74S1053PWG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74S1053PWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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