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UC5641PW24TR

Texas Instruments

UC5641PW24TR by Texas Instruments

UC5641PW24TR by Texas Instruments is a 3.3V Data Bus Terminator with 24 terminals in a small outline package. Operating b/w 0-70°C, it uses bipolar technology and has Gull Wing terminals for commercial applications requiring surface mount terminators.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,263 parts In-Stock

1+ parts

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4,263

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Digiode

USA . 2,752 parts In-Stock

1+ parts

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2,752

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 943 parts In-Stock

1+ parts

$7.500

100+ parts

-

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943

$7.500

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AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$8.718

100+ parts

-

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590

$8.718

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Parana Technologies

USA . 221 parts In-Stock

1+ parts

$13.262

100+ parts

-

1k+ parts

$13.766

10k+ parts

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221

$13.262

-

$13.766

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DigiPath Technology Company

USA . 845 parts In-Stock

1+ parts

$14.603

100+ parts

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845

$14.603

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ChromeModa Solutions

Germany . 930 parts In-Stock

1+ parts

$14.901

100+ parts

$12.219

1k+ parts

-

10k+ parts

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930

$14.901

$12.219

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IDEA Electronic Components Group

UK . 876 parts In-Stock

1+ parts

$14.901

100+ parts

$14.156

1k+ parts

$13.411

10k+ parts

-

876

$14.901

$14.156

$13.411

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Corphita

USA . 4,545 parts In-Stock

1+ parts

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4,545

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Overview

Upgrade your data bus system with the high-quality UC5641PW24TR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional performance and reliability. This small outline, thin profile terminator is ideal for a wide range of applications, ensuring smooth communication and optimal signal transmission. With a nominal supply voltage of 3.3V and commercial temperature grade, this product offers unparalleled value and benefits to customers looking for top-notch solutions. Trust Texas Instruments to elevate your data bus network to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, ensuring a long-lasting product.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing designs and layouts.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with a wide range of systems.

No. of Terminals: 24

Ample number of terminals for connecting to various components and devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline and thin profile design with shrink pitch for space-saving and efficient PCB layout.

Maximum Operating Temperature: 70 °C

Can operate at high temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Can function in low temperature environments as well, ensuring versatility.

Terminal Position: DUAL

Dual terminal position provides flexibility in connections and routing.

Temperature Grade: COMMERCIAL

Commercial grade temperature rating suitable for standard operating conditions.

Technology: BIPOLAR

Bipolar technology offers reliable signal quality and performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connections.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V, ensuring consistent power delivery.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635mm allows for precise connections and compact layout.

Technical Specifications

Data Bus Terminators UC5641PW24TR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Bus Terminators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UC5641PW24TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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