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UCC5647PM

Texas Instruments

UCC5647PM by Texas Instruments

UCC5647PM by Texas Instruments is a Data Bus Terminator with 64 terminals, operating voltage range of 2.7V to 5.25V, and BICMOS technology. It features a low profile flatpack package style suitable for SCSI bus terminators, with differential output and nominal pull-up resistance of 105 ohm. Ideal for commercial applications requiring precise signal termination in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,866 parts In-Stock

1+ parts

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7,866

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Digiode

USA . 4,178 parts In-Stock

1+ parts

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4,178

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,279 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

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1,279

$5.500

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AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$10.015

100+ parts

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330

$10.015

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Parana Technologies

USA . 578 parts In-Stock

1+ parts

$12.401

100+ parts

-

1k+ parts

$12.838

10k+ parts

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578

$12.401

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$12.838

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DigiPath Technology Company

USA . 171 parts In-Stock

1+ parts

$13.655

100+ parts

$12.563

1k+ parts

-

10k+ parts

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171

$13.655

$12.563

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ChromeModa Solutions

Germany . 4,338 parts In-Stock

1+ parts

$13.934

100+ parts

$11.426

1k+ parts

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4,338

$13.934

$11.426

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IDEA Electronic Components Group

UK . 492 parts In-Stock

1+ parts

$13.934

100+ parts

$13.237

1k+ parts

$12.541

10k+ parts

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492

$13.934

$13.237

$12.541

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Corphita

USA . 4,337 parts In-Stock

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4,337

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Overview

Enhance your data bus systems with the high-quality UCC5647PM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and reliability. Ideal for SCSI bus terminators, this product offers seamless integration, efficient operation, and precise signal transmission. Take advantage of its innovative technology, low profile design, and wide temperature range to elevate your applications to new heights. Trust Texas Instruments to deliver exceptional products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and can withstand harsh operating conditions, making it a reliable choice.

Surface Mount: YES

Surface mount capability allows for easy installation and compact design, saving space on the PCB.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltage, providing flexibility in power requirements.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on the PCB.

Power Supplies (V): 3/5

Support for multiple power supplies allows for compatibility with various systems.

No. of Terminals: 64

Higher number of terminals enable connection to multiple signal lines, improving functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch design enhances space efficiency and signal integrity.

Minimum Supply Voltage: 2.7 V

Can operate at low supply voltage, conserving power and reducing energy costs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance in various environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature guarantees functionality even in cold conditions.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signal lines and connections.

Maximum Seated Height: 1.6 mm

Low seated height contributes to a compact overall design and facilitates installation in tight spaces.

Width: 10 mm

Compact width dimension enables placement in narrow areas on the PCB.

Differential Output: YES

Differential output helps reduce noise and improve signal integrity in data transmission.

Length: 10 mm

Short length dimension saves space on the PCB and contributes to a compact design.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability and performance in standard operating conditions.

Nominal Pull Up Resistance: 105 ohm

Nominal pull up resistance value helps optimize signal quality and data transmission.

Technology: BICMOS

BICMOS technology offers a good balance between speed, power consumption, and reliability in data bus termination.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection to the PCB, improving installation efficiency.

No. of Signal Lines: 27

Sufficient number of signal lines cater to various data transfer requirements, enhancing versatility.

Terminal Pitch: 0.5 mm

Fine terminal pitch enhances connectivity precision and enables high-density mounting on the PCB.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed as a SCSI bus terminator, ensuring compatibility and optimal performance in SCSI data bus systems.

Technical Specifications

Data Bus Terminators UCC5647PM attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

UCC5647PM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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