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CD40117BD

Texas Instruments

CD40117BD by Texas Instruments

CD40117BD by Texas Instruments is a CMOS data bus terminator with 2 functions. It operates b/w -55 to 125 °C and supports supply voltages of 3-18 V. Ideal for military applications, it has 14 terminals in an in-line package style.

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1k+

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Vyrian

USA . 2,631 parts In-Stock

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Digiode

USA . 1,817 parts In-Stock

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One Stop Electronics

USA . 1,191 parts In-Stock

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$9.500

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AZTECH Wire

Italy . 510 parts In-Stock

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Parana Technologies

USA . 1,993 parts In-Stock

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$13.240

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$13.745

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ChromeModa Solutions

Germany . 4,895 parts In-Stock

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IDEA Electronic Components Group

UK . 319 parts In-Stock

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$14.132

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$13.388

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Native Components

USA . 757 parts In-Stock

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$73.370

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Northwest PG Solutions

USA . 131 parts In-Stock

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Supply Digital

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Corphita

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DigiPath Technology Company

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Overview

Enhance your electronic projects with the CD40117BD by Texas Instruments, a premium quality Data Bus Terminator that guarantees superior performance and reliability. Manufactured by industry leader Texas Instruments, this cutting-edge product offers unmatched value and benefits for a wide range of applications. From its durable ceramic, glass-sealed package body to its advanced CMOS technology, this terminator provides users with precise terminal positioning and efficient power supplies. Experience seamless connectivity and exceptional functionality with the CD40117BD, the ideal choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and reliability in various operating conditions.

Maximum Supply Voltage: 18 V

The high maximum supply voltage allows for compatibility with a wide range of systems and applications.

No. of Functions: 2

Having 2 functions enables this terminator to handle multiple signal lines efficiently, improving data transmission.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into existing setups and provides a compact design for space-saving installations.

Power Supplies (V): 5/15

The availability of multiple power supply options allows for flexibility in different power requirements and configurations.

No. of Terminals: 14

With 14 terminals, this terminator offers ample connection points for various signal lines, enhancing connectivity options.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance processes by providing a straightforward and organized layout.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and compatibility with systems that require lower power input.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows for reliable performance in extreme environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures functionality in cold environments without compromising performance.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved signal integrity, reducing the risk of signal loss or distortion.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for easy integration into compact spaces or dense installations with limited vertical clearance.

Width: 7.62 mm

The moderate width makes this terminator compatible with standard spacing requirements and allows for easy placement in various setups.

Length: 19.56 mm

The moderate length offers a balance between flexibility and compactness, making it suitable for various installation configurations.

Temperature Grade: MILITARY

The military-grade temperature rating ensures robust performance in harsh environments and critical applications where reliability is paramount.

Technology: CMOS

The CMOS technology used in this terminator provides high-speed operation, low power consumption, and compatibility with a wide range of devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation process and ensures secure connections, reducing the risk of signal interference or disconnection.

No. of Signal Lines: 4

With support for 4 signal lines, this terminator can accommodate multiple data streams simultaneously, enhancing overall system performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a standard power input level that is widely supported in many systems and applications.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connection and compatibility with standard terminal blocks, enhancing installation flexibility.

Interface IC Type: OTHER TERMINATOR

Being classified as 'OTHER TERMINATOR' indicates that this product is specifically designed for data bus termination applications, ensuring optimal functionality in such scenarios.

Technical Specifications

Data Bus Terminators CD40117BD attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

No. of Functions:

2

No. of Signal Lines:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD40117BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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