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CD40117BEE4

Texas Instruments

CD40117BEE4 by Texas Instruments

CD40117BEE4 by Texas Instruments is a CMOS data bus terminator with 2 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 3-18 V and features 14 terminals in an IN-LINE package style. Ideal for military-grade applications requiring termination of up to 4 signal lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,239 parts In-Stock

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Digiode

USA . 395 parts In-Stock

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395

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Native Components

USA . 754 parts In-Stock

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$1.319

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754

$1.319

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Northwest PG Solutions

USA . 776 parts In-Stock

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$1.451

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Parana Technologies

USA . 250 parts In-Stock

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$3.049

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$3.562

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$3.049

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DigiPath Technology Company

USA . 151 parts In-Stock

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$3.357

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$3.089

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$3.089

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ChromeModa Solutions

Germany . 6,754 parts In-Stock

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$3.426

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$2.809

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$3.426

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IDEA Electronic Components Group

UK . 587 parts In-Stock

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$3.426

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$3.083

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AZTECH Wire

Italy . 701 parts In-Stock

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$12.174

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One Stop Electronics

USA . 890 parts In-Stock

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$41.500

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Corphita

USA . 4,806 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the CD40117BEE4 by Texas Instruments. Crafted with precision and expertise, this innovative Data Bus Terminator offers unparalleled quality and reliability for a wide range of applications. From military-grade technology to dual terminal positions, this product delivers exceptional performance and value. Experience enhanced functionality and efficiency with Texas Instruments' cutting-edge solutions. Elevate your projects with the CD40117BEE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the terminator, ensuring a longer lifespan.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, this terminator can handle a wide range of electrical input, making it versatile for different systems.

No. of Functions: 2

Having multiple functions allows this terminator to handle different types of data bus configurations efficiently.

Power Supplies (V): 5/15

The availability of multiple power supply options gives flexibility in setting up the terminator according to the system requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this terminator can perform reliably even in harsh thermal conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the terminator can function effectively in extreme cold environments.

Temperature Grade: MILITARY

Being military-grade indicates that this terminator meets stringent quality and reliability standards, making it suitable for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this terminator energy-efficient and reliable for data transmission.

Technical Specifications

Data Bus Terminators CD40117BEE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

No. of Functions:

2

No. of Signal Lines:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD40117BEE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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