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CD40117BME4

Texas Instruments

CD40117BME4 by Texas Instruments

CD40117BME4 by Texas Instruments is a Data Bus Terminator with 2 functions, operating at 3-18 V. It comes in a small outline package and can withstand temperatures from -55 to 125 °C. Ideal for military-grade applications requiring CMOS technology and GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,939 parts In-Stock

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Digiode

USA . 2,908 parts In-Stock

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2,908

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Distributors (Availability)

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Native Components

USA . 571 parts In-Stock

1+ parts

$0.085

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-

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$0.082

571

$0.085

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$0.082

Northwest PG Solutions

USA . 1,723 parts In-Stock

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$0.094

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$0.082

1,723

$0.094

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$0.082

Parana Technologies

USA . 1,100 parts In-Stock

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$6.568

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$7.309

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$6.568

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$7.309

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

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$7.380

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$6.642

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1,587

$7.380

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$6.642

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ChromeModa Solutions

Germany . 1,559 parts In-Stock

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$7.380

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$6.052

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$7.380

$6.052

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AZTECH Wire

Italy . 574 parts In-Stock

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$8.698

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574

$8.698

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One Stop Electronics

USA . 849 parts In-Stock

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$44.500

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849

$44.500

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QUARKTWIN TECHNOLOGY LTD

USA . 27,993 parts In-Stock

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Corphita

USA . 2,498 parts In-Stock

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$6.654

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Microchip USA

USA . 273 parts In-Stock

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Overview

Elevate your data bus performance with the Texas Instruments CD40117BME4. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that ensure reliability and efficiency. Designed for a wide range of applications, this Data Bus Terminator offers unparalleled value and benefits to customers seeking seamless connectivity and optimal signal transmission. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to environmental factors, making the product long-lasting.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort in assembly.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, adding versatility to its usage.

No. of Functions: 2

Having two functions in one component makes this product space-efficient and cost-effective.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and fits well with standard PCB designs, ensuring compatibility with various setups.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to perform reliably in a variety of environments, including harsh conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the product can function effectively even in cold climates without issues.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in data transmission.

Technical Specifications

Data Bus Terminators CD40117BME4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

2

No. of Signal Lines:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD40117BME4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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