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CD40117BPW

Texas Instruments

CD40117BPW by Texas Instruments

CD40117BPW by Texas Instruments is a CMOS data bus terminator with 2 functions, operating at -55 to 125 °C. It has a supply voltage range of 3-18 V and comes in a small outline package suitable for military applications. The device features dual terminals, Gull Wing form, and is surface mountable with 0.65 mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,235 parts In-Stock

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Digiode

USA . 877 parts In-Stock

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Native Components

USA . 857 parts In-Stock

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$0.160

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$0.154

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Northwest PG Solutions

USA . 1,140 parts In-Stock

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$0.176

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Parana Technologies

USA . 1,067 parts In-Stock

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$7.268

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$7.768

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AZTECH Wire

Italy . 439 parts In-Stock

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$7.897

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ChromeModa Solutions

Germany . 2,136 parts In-Stock

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$8.166

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$6.696

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IDEA Electronic Components Group

UK . 784 parts In-Stock

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$7.349

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One Stop Electronics

USA . 456 parts In-Stock

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$24.500

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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DigiPath Technology Company

USA . 1,225 parts In-Stock

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Corphita

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Overview

Elevate your data bus system with the CD40117BPW by Texas Instruments, a top-quality data bus terminator designed for maximum performance and reliability. Manufactured by a trusted industry leader, this product offers unparalleled value and benefits to customers in various applications. With its innovative design and advanced technology, this terminator ensures seamless operation and optimal signal transmission. Upgrade your system today with the CD40117BPW and experience the difference in quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the terminator, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 18 V

Can accommodate a wide range of supply voltages, making it versatile for various applications.

No. of Functions: 2

Offers multiple functions in a single component, saving space on the circuit board.

Package Shape: RECTANGULAR

Easily fits into standard circuit board layouts, making it compatible with many designs.

Power Supplies (V): 5/15

Provides flexibility in power supply options, allowing for compatibility with different power sources.

No. of Terminals: 14

Offers multiple connection points for interfacing with other components, increasing connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and low profile design save space on the circuit board, ideal for applications with limited space.

Minimum Supply Voltage: 3 V

Works efficiently even at low supply voltages, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for applications in harsh environments.

Minimum Operating Temperature: -55 °C

Operates reliably in extreme cold conditions, ensuring consistent performance in a wide range of environments.

Terminal Position: DUAL

Offers redundancy in connection points, improving reliability and ensuring data integrity.

Maximum Seated Height: 1.2 mm

Low profile design reduces the overall height of the circuit board, ideal for compact electronic devices.

Width: 4.4 mm

Compact width saves space on the circuit board, allowing for more components to be integrated.

Length: 5 mm

Small footprint fits well within circuit board layouts, maximizing space efficiency.

Temperature Grade: MILITARY

Meets stringent military standards for temperature resistance and ruggedness, ensuring reliability in harsh conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and fast operation, enhancing energy efficiency and performance.

Terminal Form: GULL WING

Gull-wing terminals provide secure and reliable connections, reducing the risk of disconnection or signal interference.

No. of Signal Lines: 4

Provides multiple signal lines for data transmission, enhancing connectivity and data transfer speed.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage ensures compatibility with a wide range of electronic devices and systems.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for compact design and efficient use of space on the circuit board.

Interface IC Type: OTHER TERMINATOR

Utilizes a specialized interface IC type for efficient data termination, ensuring data integrity and signal quality.

Technical Specifications

Data Bus Terminators CD40117BPW attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Functions:

2

No. of Signal Lines:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD40117BPW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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