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LP2998MA

Texas Instruments

LP2998MA by Texas Instruments

LP2998MA by Texas Instruments is a data bus terminator with 8 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 2.2V to 5.5V and is suitable for automotive applications due to its small outline package style and gull wing terminal form.

Median Price

$1.406

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 26,590 parts In-Stock

1+ parts

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26,590

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Vyrian

USA . 5,067 parts In-Stock

1+ parts

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5,067

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Anansix

USA . 2,101 parts In-Stock

1+ parts

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2,101

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Digiode

USA . 1,272 parts In-Stock

1+ parts

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1,272

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Cyclops Electronics Ltd

UK . 475 parts In-Stock

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475

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Bristol Electronics

USA . 52 parts In-Stock

1+ parts

-

100+ parts

$1.406

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52

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$1.406

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Microfarads

USA . 48 parts In-Stock

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48

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Prism Electronics

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,101 parts In-Stock

1+ parts

$7.929

100+ parts

-

1k+ parts

$8.490

10k+ parts

-

2,101

$7.929

-

$8.490

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DigiPath Technology Company

USA . 1,300 parts In-Stock

1+ parts

$8.731

100+ parts

$8.032

1k+ parts

-

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1,300

$8.731

$8.032

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ChromeModa Solutions

Germany . 6,133 parts In-Stock

1+ parts

$8.909

100+ parts

$7.305

1k+ parts

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6,133

$8.909

$7.305

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IDEA Electronic Components Group

UK . 293 parts In-Stock

1+ parts

$8.909

100+ parts

$8.464

1k+ parts

$8.018

10k+ parts

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293

$8.909

$8.464

$8.018

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AZTECH Wire

Italy . 700 parts In-Stock

1+ parts

$17.276

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700

$17.276

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One Stop Electronics

USA . 495 parts In-Stock

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$26.500

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495

$26.500

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Alle Elektronik GmbH

Germany . 1,713 parts In-Stock

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1,713

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Corphita

USA . 1,206 parts In-Stock

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Kepictronics

USA . 151 parts In-Stock

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151

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Overview

Enhance your electronic designs with the LP2998MA from Texas Instruments, a leading manufacturer known for top-quality products. This data bus terminator offers unmatched reliability and efficiency in a compact package, making it ideal for a wide range of applications. With a wide supply voltage range and automotive-grade temperature grade, this versatile product ensures optimal performance in any environment. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Upgrade your projects today with the LP2998MA!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5V, making it compatible with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the terminator to other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes space required for installation, ideal for compact designs.

Minimum Supply Voltage: 2.2 V

Can operate effectively with a minimum supply voltage of 2.2V, suitable for low-power applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures up to 125°C, suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures down to -40°C, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good conductivity and solderability.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit board layout and connection options.

Maximum Seated Height: 1.75 mm

Low seated height helps in compact designs with space constraints.

Width: 3.9 mm

Narrow width allows for efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring reliable soldering.

Peak Reflow Temperature °C: 235

Capable of withstanding peak reflow temperature of 235°C, ensuring proper soldering in assembly process.

Length: 4.9 mm

Compact length facilitates space-saving installation on the circuit board.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, meeting the required temperature and performance standards.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto the PCB, ensuring secure connections.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V ensures stability and compatibility with standard voltage levels.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm allows for precise connections and compatibility with standard PCB layouts.

Interface IC Type: OTHER TERMINATOR

Designed as a terminator for specific interface ICs, ensuring compatibility and proper signal termination.

Technical Specifications

Data Bus Terminators LP2998MA attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

LP2998MA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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