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SA12B5

STMicroelectronics

SA12B5 by STMicroelectronics

SA12B5 by STMicroelectronics is a dual-terminal diode bus termination array designed for industrial applications. It features a compact 16-terminal SO package, operating b/w -40 °C to 85 °C. Ideal for data bus systems, it ensures signal integrity in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,473 parts In-Stock

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3,473

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Anansix

USA . 255 parts In-Stock

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255

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ECAB

Sweden . 223 parts In-Stock

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223

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Digiode

USA . 95 parts In-Stock

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,109 parts In-Stock

1+ parts

$9.997

100+ parts

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1k+ parts

$8.997

10k+ parts

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2,109

$9.997

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$8.997

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MKK Technologies

India . 1,985 parts In-Stock

1+ parts

$18.798

100+ parts

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1,985

$18.798

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DigiPath Technology Company

USA . 1,985 parts In-Stock

1+ parts

$18.798

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1,985

$18.798

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Corphita

USA . 2,609 parts In-Stock

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2,609

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Parana Technologies

USA . 1,530 parts In-Stock

1+ parts

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100+ parts

$11.953

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1,530

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$11.953

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Kepictronics

USA . 44 parts In-Stock

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44

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Overview

Unlock unparalleled performance with the SA12B5 from STMicroelectronics, a leader in innovative electronics. This compact data bus terminator ensures reliable operation even in extreme industrial conditions, offering superior signal integrity and reduced noise for your applications. With its robust construction and dual terminal design, it seamlessly enhances connectivity in any setup, delivering exceptional value and peace of mind for engineers and manufacturers alike. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy material ensures high reliability and performance in various environmental conditions, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for efficient usage of PCB space, facilitating high-density circuit designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout options on circuit boards, improving integration with other components.

No. of Terminals: 16

With 16 terminals, this terminator supports multiple connections, providing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint while maintaining performance, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures that the product can withstand high thermal environments, enhancing reliability.

Minimum Operating Temperature: -40 °C

Rated for operation as low as -40 °C, it is well-suited for extreme cold environments, ensuring functional integrity.

Terminal Position: DUAL

Dual terminal positioning facilitates versatile layout options, enhancing design flexibility for different applications.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm supports compact designs, making it easier to fit into smaller assemblies.

Width: 3.9 mm

A narrow width of 3.9 mm contributes to a slim profile, aiding in high-density board designs.

Length: 9.9 mm

With a length of 9.9 mm, this product balances size and functionality, making it convenient for various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification indicates robust performance across a range of demanding conditions.

Terminal Form: GULL WING

Gull wing terminal design offers effective soldering surface area for reliable electrical connections and ease of manufacturing.

No. of Signal Lines: 12

Supporting 12 signal lines maximizes data throughput, making this product effective for high-performance applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch enables placement on dense PCBs while maintaining robustness in connections.

Interface IC Type: DIODE BUS TERMINATION ARRAY

As a diode bus termination array, this IC type ensures signal integrity and effective noise reduction, enhancing overall system performance.

Technical Specifications

Data Bus Terminators SA12B5 attributes and parameters. Explore more Data Bus Terminators devices from STMicroelectronics

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Signal Lines:

12

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SA12B5 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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