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UCC5641PW28TRG4

Texas Instruments

UCC5641PW28TRG4 by Texas Instruments

UCC5641PW28TRG4 by Texas Instruments is a 28-terminal data bus terminator with a supply voltage of 3.3V. It features a small outline, thin profile package style and operates b/w 0°C to 70°C. Ideal for commercial applications requiring surface mount terminators in plastic/epoxy material packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,146 parts In-Stock

1+ parts

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5,146

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Digiode

USA . 4,743 parts In-Stock

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4,743

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 769 parts In-Stock

1+ parts

$9.592

100+ parts

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769

$9.592

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Parana Technologies

USA . 2,256 parts In-Stock

1+ parts

$12.031

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$12.437

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2,256

$12.031

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$12.437

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DigiPath Technology Company

USA . 1,648 parts In-Stock

1+ parts

$13.248

100+ parts

$12.188

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1,648

$13.248

$12.188

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ChromeModa Solutions

Germany . 1,913 parts In-Stock

1+ parts

$13.518

100+ parts

$11.085

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1,913

$13.518

$11.085

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IDEA Electronic Components Group

UK . 1,260 parts In-Stock

1+ parts

$13.518

100+ parts

$12.842

1k+ parts

$12.166

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1,260

$13.518

$12.842

$12.166

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One Stop Electronics

USA . 1,233 parts In-Stock

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$19.500

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1,233

$19.500

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Corphita

USA . 2,454 parts In-Stock

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2,454

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Overview

Elevate your data bus terminators with the UCC5641PW28TRG4 from Texas Instruments. Known for their high-quality components, Texas Instruments delivers exceptional reliability and performance. Ideal for a wide range of applications, this product offers unmatched value with its compact design and efficient power supply. Experience seamless connectivity and enhanced data transmission with the UCC5641PW28TRG4, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the internal components of the data bus terminator, making it reliable for long-term use.

Surface Mount: YES

Being surface mountable enables easy and convenient installation on circuit boards, saving space and providing a sleek appearance to the overall design.

Power Supplies (V): 3.3

Operating at a low voltage of 3.3V allows for efficient power consumption, reducing energy costs and minimizing heat dissipation.

No. of Terminals: 28

Having 28 terminals offers versatility and compatibility with various systems, allowing for multiple connections and enhanced functionality.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this data bus terminator can perform reliably in harsh environmental conditions without the risk of overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the data bus terminator can function effectively even in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connectivity options, allowing for versatile configurations and ease of integration into different systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this data bus terminator is designed for standard operating conditions typically found in commercial applications, ensuring compatibility and reliable performance.

Terminal Form: GULL WING

The gull wing terminal form offers a secure and stable connection, reducing the risk of signal interference or disconnection, resulting in reliable data transmission.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources, making it easy to integrate into existing systems without the need for additional power adjustments.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for compact and efficient layout designs, enabling high-density packaging and saving valuable board space in densely populated circuit boards.

Technical Specifications

Data Bus Terminators UCC5641PW28TRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Bus Terminators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UCC5641PW28TRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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