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LP2998MRX

Texas Instruments

LP2998MRX by Texas Instruments

LP2998MRX by Texas Instruments is a small outline, low profile data bus terminator with 8 terminals. It operates b/w -40 to 125°C and has a supply voltage range of 2.2V to 5.5V, making it suitable for automotive applications requiring high temperature tolerance and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 92,500 parts In-Stock

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Digiode

USA . 3,333 parts In-Stock

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Vyrian

USA . 3,106 parts In-Stock

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Anansix

USA . 164 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,901 parts In-Stock

1+ parts

$6.201

100+ parts

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$6.964

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1,901

$6.201

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$6.964

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DigiPath Technology Company

USA . 139 parts In-Stock

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$6.828

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139

$6.828

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ChromeModa Solutions

Germany . 2,535 parts In-Stock

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$6.967

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$5.713

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$6.967

$5.713

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IDEA Electronic Components Group

UK . 958 parts In-Stock

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$6.967

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$6.270

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958

$6.967

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$6.270

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AZTECH Wire

Italy . 556 parts In-Stock

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$14.570

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556

$14.570

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One Stop Electronics

USA . 222 parts In-Stock

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$33.500

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222

$33.500

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Lixinc

USA . 13,583 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,605 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,070 parts In-Stock

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iodParts Technologies Inc.

India . 2,406 parts In-Stock

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Corphita

USA . 1,096 parts In-Stock

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Kepictronics

USA . 125 parts In-Stock

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125

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Overview

Unlock the potential of your data bus systems with the LP2998MRX by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This small outline, heat sink package offers customers a high-performance data bus terminator that operates efficiently in automotive environments. Experience seamless connectivity and enhanced performance with the LP2998MRX - a must-have solution for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring the product can withstand harsh conditions.

Surface Mount: YES

Facilitates easy and efficient installation, especially in compact or crowded electronic components.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of compatible devices and power sources, increasing versatility.

Package Shape: RECTANGULAR

Enables efficient placement and organization within circuit boards, optimizing space usage.

No. of Terminals: 8

Provides multiple connection points for various components, enhancing connectivity options.

Minimum Supply Voltage: 2.2 V

Allows for operation with lower power sources, increasing flexibility in application scenarios.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments, ideal for industrial or automotive use.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Provides good electrical conductivity and corrosion resistance, ensuring stable connections over time.

Terminal Position: DUAL

Offers multiple connection options, allowing for different wiring configurations and layouts.

Width: 3.9 mm

Compact size enables the product to fit in tight spaces, ideal for crowded circuit boards.

Temperature Grade: AUTOMOTIVE

Meets industry standards for automotive applications, ensuring reliability in vehicle electronics.

Termimal Pitch: 1.27 mm

Provides precise spacing for connection points, reducing the risk of short circuits or interference.

Technical Specifications

Data Bus Terminators LP2998MRX attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.68 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

LP2998MRX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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