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UCC5680PW24TRG4

Texas Instruments

UCC5680PW24TRG4 by Texas Instruments

UCC5680PW24TRG4 by Texas Instruments is a SCSI bus terminator with 24 terminals and BICMOS technology. It operates b/w 0 to 70°C, with a supply voltage range of 2.7V to 5.25V. This small outline package is ideal for data bus termination applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,792 parts In-Stock

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Digiode

USA . 4,684 parts In-Stock

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4,684

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Distributors (Availability)

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One Stop Electronics

USA . 990 parts In-Stock

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$7.500

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990

$7.500

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Parana Technologies

USA . 1,618 parts In-Stock

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$7.573

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$8.084

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1,618

$7.573

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$8.084

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AZTECH Wire

Italy . 673 parts In-Stock

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$8.286

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673

$8.286

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DigiPath Technology Company

USA . 359 parts In-Stock

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$8.339

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359

$8.339

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ChromeModa Solutions

Germany . 2,477 parts In-Stock

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$8.509

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$6.977

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2,477

$8.509

$6.977

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IDEA Electronic Components Group

UK . 855 parts In-Stock

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$8.509

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$8.084

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$7.658

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855

$8.509

$8.084

$7.658

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Semicontronic

India . 232 parts In-Stock

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$31.500

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$30.712

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$30.555

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232

$31.500

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$30.555

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Component Stockers USA

USA . 659 parts In-Stock

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$99.990

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Corphita

USA . 2,089 parts In-Stock

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Microchip USA

USA . 287 parts In-Stock

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Overview

Elevate your data bus performance with the UCC5680PW24TRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This SCSI bus terminator offers unparalleled value with its advanced technology, ensuring seamless communication between devices. Perfect for various applications, this compact and efficient device guarantees optimal performance and durability. Upgrade your system today with the UCC5680PW24TRG4 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it a good choice for long-term use.

Surface Mount: YES

Surface mount technology makes installation and integration easier, saving time and effort in setup.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for versatile compatibility with different systems and components.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies provides flexibility in system configurations.

No. of Terminals: 24

Having 24 terminals allows for efficient connection and communication with multiple devices or components.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures optimal performance even in challenging environmental conditions.

Width: 4.4 mm

The compact width of 4.4mm enables space-saving installation, particularly useful in tight setups or configurations.

Differential Output: YES

Differential output helps in reducing noise and interference, ensuring clear and reliable signal transmission.

Technology: BICMOS

The use of BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and efficiency.

No. of Signal Lines: 9

Having 9 signal lines allows for versatile connectivity and communication capabilities, suitable for complex data bus systems.

Technical Specifications

Data Bus Terminators UCC5680PW24TRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

UCC5680PW24TRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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