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UC5612N

Texas Instruments

UC5612N by Texas Instruments

The Texas Instruments UC5612N is a SCSI bus terminator with 16 terminals and a supply voltage range of 3.8V to 5.25V. It operates in commercial temperature grades up to 70°C, featuring a nominal pull-up resistance of 110 ohms. This rectangular package is ideal for data bus termination applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,001 parts In-Stock

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4,001

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Digiode

USA . 449 parts In-Stock

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449

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Distributors (Availability)

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AZTECH Wire

Italy . 689 parts In-Stock

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$6.539

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689

$6.539

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Parana Technologies

USA . 730 parts In-Stock

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$7.348

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$7.841

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730

$7.348

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DigiPath Technology Company

USA . 896 parts In-Stock

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$8.091

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896

$8.091

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ChromeModa Solutions

Germany . 6,869 parts In-Stock

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$8.256

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$6.770

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6,869

$8.256

$6.770

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IDEA Electronic Components Group

UK . 1,783 parts In-Stock

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$8.256

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$7.430

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$8.256

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$7.430

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One Stop Electronics

USA . 787 parts In-Stock

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$29.500

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787

$29.500

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Kepictronics

USA . 100 parts In-Stock

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100

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Corphita

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Overview

Enhance your data bus systems with the reliable and efficient UC5612N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. The UC5612N is a versatile SCSI bus terminator suitable for various applications, providing seamless integration and optimal signal transmission. Elevate your projects with the value and benefits of this innovative product, offering superior functionality and durability. Upgrade your data bus terminators today with the UC5612N from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for ensuring the longevity of the device in various operating conditions.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options, making the product compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing setups and systems, ensuring a seamless installation process.

Power Supplies (V): 5

Operating at a standard power supply of 5V, this product is compatible with most common power sources, making it convenient for users.

No. of Terminals: 16

Having a higher number of terminals provides more connection options, increasing the versatility of the product for different setups and configurations.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals ensures a reliable and secure connection, reducing the risk of signal interference or loss.

Width: 7.62 mm

The compact width of the product allows for easy installation in tight spaces, making it a practical choice for various applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product can operate effectively within standard temperature ranges, making it suitable for commercial use.

Nominal Pull Up Resistance: 110 ohm

The nominal pull up resistance value of 110 ohm helps stabilize the signal lines, reducing the risk of signal distortion or noise in data transmission.

Technology: BIPOLAR

The bipolar technology used in the product enhances the performance and reliability of the data bus terminator, ensuring accurate and efficient data transmission.

Technical Specifications

Data Bus Terminators UC5612N attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.305 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

UC5612N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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